Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same
Abstract
A feedthrough device for use in deposition chambers such as chemical vapor deposition chambers and atomic layer deposition chambers and methods using the same in association with such chambers as well as chambers so equipped. The feedthrough device includes an associated heating device to maintain the temperature of the feedthrough device above a predetermined level and thus maintain a temperature differential between the deposition chamber body and a vaporize organometallic precursor as it passes therethrough. The feedthrough device may include a helical groove formed along the surface of a longitudinal body portion thereof to complementarily receive a resistance type cable heater. The heater may further include a temperature sensing device to assist in monitoring and controlling the temperature of the feedthrough device.
Claims
exact text as granted — not AI-modified1 . A feedthrough device for conveying liquid through a chamber body of a deposition chamber, the feedthrough device comprising:
a longitudinal body having a first end and a second end; a lumen defined to extend through the longitudinal body from the first end to the second end; and a heating device associated with the longitudinal body configured for heating the feedthrough device, wherein the feedthrough device is configured to be complementarily received in an internal portion of the chamber body.
2 . The feedthrough device of claim 1 , wherein the heating device includes a resistance heater.
3 . The feedthrough device of claim 2 , further comprising a helical groove formed on an exterior surface of the longitudinal body and wherein at least a portion of the resistance heater is disposed within the helical groove.
4 . The feedthrough device of claim 3 , wherein the resistance heater includes a conductive sheath and wherein the helical groove is configured to complementarily receive at least a portion of the conductive sheath.
5 . The feedthrough device of claim 4 , wherein at least a portion of the conductive sheathing is adhered to the longitudinal body.
6 . The feedthrough device of claim 4 , wherein at least a portion of the conductive sheathing is welded to the longitudinal body.
7 . The feedthrough device of claim 4 , wherein the conductive sheath is formed of stainless steel.
8 . The feedthrough device of claim 1 , further comprising a temperature sensing device associated with the heating device and longitudinal body.
9 . The feedthrough device of claim 8 , wherein the temperature sensing device includes a thermocouple.
10 . The feedthrough device of claim 8 , wherein the temperature sensing device is positioned within a conductive sheath.
11 . The feedthrough device of claim 1 , further comprising a shoulder portion adjacent the first end of the longitudinal body, wherein the longitudinal body exhibits a first diameter and the shoulder portion exhibits a second larger diameter.
12 . The feedthrough device of claim 11 , further comprising at least one channel formed in a surface of the shoulder portion, the at least one channel being configured to at least partially receive a sealing member therein.
13 . The feedthrough device of claim 11 , further including a coupling portion adjacent the second end of the longitudinal body, the coupling portion being configured to be sealingly coupled to a portion of plumbing associated with a vapor source.
14 . The feedthrough device of claim 13 , wherein the coupling portion includes a set of threads.
15 . The feedthrough device of claim 13 , wherein at least the longitudinal body comprises stainless steel.
16 . The feedthrough device of claim 13 , wherein at least the longitudinal body comprises aluminum.
17 . A method of converting a chemical vapor deposition chamber having a chamber body, a chamber lid and a first feedthrough device positioned in an interior portion of the chamber body into an atomic layer deposition chamber, the method comprising:
removing the first feedthrough device from the chamber body; and inserting a second feedthrough device and an associated heating device into the interior portion of the chamber body.
18 . The method according to claim 17 , further comprising configuring the associated heating device to helically surround at least a portion of the second feedthrough device.
19 . The method of according to claim 18 , further comprising forming a helical groove in the second feedthrough device to complementarily receive at least a portion of the associated heating device.
20 . A method of converting a chemical vapor deposition chamber having a chamber body, chamber lid and a feedthrough device positioned in an interior portion of the chamber body into an atomic layer deposition chamber, the method comprising:
removing the feedthrough device; fitting the feedthrough device with a heater device; disposing the feedthrough device and heater device into the interior portion of the chamber body.
21 . The method according to claim 20 , wherein fitting the feedthrough device with a heater device includes forming a helical groove in an exterior surface of the feedthrough device and complementarily positioning at least a portion of the heater device into the helical groove.
22 . A method of delivering vapor to a vapor delivery head in a deposition chamber, the method comprising:
providing a source of vapor; defining a vapor delivery path between the source of vapor and the vapor delivery head including:
providing a first section of plumbing from the source of vapor to a chamber body of the deposition chamber;
providing a feedthrough device in an interior portion of the chamber body;
coupling the feedthrough device to the first section of plumbing;
providing a second section of plumbing from the feedthrough device to the vapor delivery head; and
coupling the second section of plumbing to the feedthrough device;
heating the first section of plumbing; and heating the feedthrough device.
23 . The method according to claim 22 , wherein heating the feedthrough device includes providing a resistance heater and helically positioning a portion of the resistance heater about a length of the feedthrough device.
24 . The method according to claim 23 , further comprising forming a helical groove along an exterior surface of the feedthrough device and positioning at least a portion of the resistance heater in the helical groove.Join the waitlist — get patent alerts
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