Manufacturing method of inkjet head, and adhesive agent composition

Abstract

Disclosed are an adhesive agent composition which has high chemical resistance and solvent resistance and is curable at around room temperature, an inkjet head which has good durability and jetting performance even in the case of using solvent ink, and a manufacturing method of the inkjet head. For these characteristics, the adhesive agent composition contains, as an activator, an imidazole derivative in which an alkyl group or a substituted alkyl group is substituted at the 1-postion or at the 1- and 2-positions, and as a base, a compound having three or more epoxy groups.

1 . A method of manufacturing an inkjet head, comprising: adhering members constituting the inkjet head together by using an adhesive agent composition, 
 wherein the adhesive agent composition contains, as an activator, an imidazole derivative in which an alkyl group or a substituted alkyl group is substituted at a 1-position or at 1- and 2-positions, contains a compound having three or more epoxy groups as a base, and is cured at 60° C. or less, thereby adhering the members together.    
   
   
       2 . The method of  claim 1 , 
 wherein a difference in linear thermal expansion coefficient between the members is 12 ppm/K or more.    
   
   
       3 . The method of  claim 1 , 
 wherein the adhesive agent composition contacts ink after being cured.    
   
   
       4 . The method of  claim 1 , 
 wherein the adhesive agent composition further contains bisphenol A type epoxy resin or bisphenol F type epoxy resin as a compound having two epoxy groups.    
   
   
       5 . The method of  claim 1 , 
 wherein, in the adhesive agent composition, an epoxy equivalent of the compound having three or more epoxy groups is 120 or less.    
   
   
       6 . The method of  claim 1 , 
 wherein, in the adhesive agent composition, the compound having three or more epoxy groups is a compound represented by a following general formula (1):                          where R 1  to R 3  are hydrogen, an alkyl group, or a substituted alkyl group, and R 4  is hydrogen, an alkyl group, an alkoxy group, alkyl amino group, substituted alkyl amino group or a substituted alkoxy group.    
   
   
       7 . The method of  claim 1 , 
 wherein, in the adhesive agent composition, the compound having three or more epoxy groups is a compound represented by a following general formula (2):                          where R 1  and R 2  are hydrogen, an alkyl group, or a substituted alkyl group.    
   
   
       8 . The method of  claim 4 , 
 wherein the compound having two epoxy groups is bisphenol F type epoxy resin,    in the base, the compound having two epoxy groups is contained by 20 to 90% by mass, and the compound having three epoxy groups is contained by 10 to 80% by mass, and    6 parts by mass or more of the activator is mixed with respect to 100 parts by mass of the base.    
   
   
       9 . The method of  claim 1 , 
 wherein the base further contains a compound having two epoxy groups, the compound having two epoxy groups is contained by 20 to 90% by mass in the base, and the compound having three or more epoxy groups is contained by 10 to 80% by mass in the base,    6 parts by mass or more of the activator is mixed with respect to 100 parts by mass of the base, and    at least one of microparticles of resin, a silane coupling agent, and zirconate is added to the adhesive agent composition.    
   
   
       10 . An adhesive agent composition, comprising: 
 as an activator, an imidazole derivative in which an alkyl group or a substituted alkyl group is substituted at a 1-postion or at 1- and 2-positions;    and as a base, a compound having three or more epoxy groups.    
   
   
       11 . The adhesive agent composition of  claim 10 , further comprising: bisphenol A type epoxy resin or bisphenol F type epoxy resin as a compound having two epoxy groups.  
   
   
       12 . The adhesive agent composition of  claim 10 , 
 wherein an epoxy equivalent of the compound having three or more epoxy groups is 120 or less.    
   
   
       13 . The adhesive agent composition of  claim 10 , 
 wherein the compound having three or more epoxy groups is a compound represented by a following general formula (1):                          where R 1  to R 3  are hydrogen, an alkyl group, or a substituted alkyl group, and R 4  is hydrogen, an alkyl group, an alkoxy group, alkyl amino group, substituted alkyl amino group or a substituted alkoxy group.    
   
   
       14 . The adhesive agent composition of  claim 10 , 
 wherein the compound having three or more epoxy groups is a compound represented by a following general formula (2):                          where R 1  and R 2  are hydrogen, an alkyl group, or a substituted alkyl group.    
   
   
       15 . The adhesive agent composition of  claim 11 , 
 wherein the compound having two epoxy groups is bisphenol F type epoxy resin,    in the base, the compound having two epoxy groups is contained by 20 to 90 percents by mass, and the compound having three epoxy groups is contained by 10 to 80 percents by mass, and    6 parts by mass or more of the activator is mixed with respect to 100 parts by mass of the base.    
   
   
       16 . The adhesive agent composition of  claim 10 , 
 wherein the base further contains a compound having two epoxy groups, the compound having two epoxy groups is contained by 20 to 90 percents by mass in the base, and the compound having three or more epoxy groups is contained by 10 to 80 percents by mass in the base,    6 parts by mass or more of the activator is mixed with respect to 100 parts by mass of the base, and    at least one of microparticles of resin, a silane coupling agent, and zirconate is added to the adhesive agent composition.