US2006210439A1PendingUtilityA1
Device and method for multiple analyte detection
Est. expiryApr 3, 2016(expired)· nominal 20-yr term from priority
Inventors:Timothy WoudenbergMichael AlbinReid B. KowallisYefim RaysbergRobert P. RagusaEmily S. Winn-Deen
B01L 2300/0864B01L 2200/0642B01L 2400/049G01N 2035/00148C40B 50/08Y10S436/808B01L 2200/027B01J 2219/00317C40B 40/06B01L 2300/0816Y10S436/809B01L 3/5027C12Q 1/08B01L 7/52B01L 2300/1827B01J 2219/00599Y10S436/807B01L 3/50851B01J 2219/00722G01N 21/6452B01L 3/502715C12Q 1/6816Y10S436/805C40B 60/14Y10T436/25Y10T436/143333
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Claims
Abstract
The invention is directed to a method and device for simultaneously testing a sample for the presence, absence, and/or amounts of one or more of a plurality of selected analytes. The invention includes, in one aspect, a device for detecting or quantitating a plurality of different analytes in a liquid sample. The device can comprise wells and each well can comprise an analyte-specific reagent effective to react with a selected analyte that may be present in the sample. Also disclosed are methods utilizing the device.
Claims
exact text as granted — not AI-modified1 . A device comprising:
a substrate comprising two or more layers and a plurality of wells formed therein, wherein at least one of the layers comprises a coated metal layer, the coated metal layer comprises a heat-conducting metal layer and an inert material coating on the heat-conducting metal layer, and the coated metal layer is sealably bonded to another layer of the substrate.
2 . The device of claim 1 , further comprising detection reagents in the plurality of wells.
3 . The device of claim 2 , wherein the detection reagents comprise reagents for polymerase chain reaction.
4 . The device of claim 2 , wherein the detection reagents comprise probes and primers for polymerase chain reaction.
5 . The device of claim 1 , wherein the inert material coating comprises a plastic polymer.
6 . The device of claim 1 , wherein the heat-conducting metal layer comprises aluminum.
7 . The device of claim 1 , wherein the heat-conducting metal layer comprises copper.Join the waitlist — get patent alerts
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