Structure and process for packaging RF MEMS and other devices

Abstract

A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate, so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.

1 - 10 . (canceled)  
     
     
         11 . A packaging structure comprising: 
 a substrate, on a surface of which are provided a plurality of devices to be packaged; and    a cap having cavities therein attached to the substrate with devices on the surface enclosed in designated cavities;    said substrate being substantially thinner than said cap and having a plurality of vias extending from said surface to an opposite surface of said substrate.    
     
     
         12 . A packaging structure according to  claim 11 , 
 wherein at least some of the vias contain metal, and    electrical connecting elements are applied to the metal of those vias at said opposite surface.    
     
     
         13 . A packaging structure according to  claim 11 , wherein the cap is attached to the substrate by a bonding technique selected from the group of electrostatic fusion bonding, anodic bonding, laser bonding, and epoxy bonding.  
     
     
         14 . A packaging structure according to  claim 11 , wherein the devices are MEMS devices.  
     
     
         15 - 19 . (canceled)