Lamination-type cooler

Abstract

A lamination-type cooler comprises: a plurality of cooling pipes for interposing and cooling electronic parts; and a pair of refrigerant headers respectively engaged with both end portions of the plurality of cooling pipes, for laminating and fixing the plurality of cooling pipes. Both end portions of a refrigerant passage formed in each cooling pipe are respectively communicated with header passages formed in the refrigerant headers. The cooling pipes are composed so that a plurality of electronic parts can be interposed between the cooling pipes being arranged in a line in a direction perpendicular to the laminating direction of the cooling pipes and also perpendicular to the passage forming direction of the refrigerant passage.

1 . A lamination-type cooler comprising: 
 a plurality of cooling pipes for interposing and cooling electronic parts; and    a pair of refrigerant headers respectively engaged with both end portions of the plurality of cooling pipes, for laminating and fixing the plurality of cooling pipes, wherein    both end portions of a refrigerant passage formed in each cooling pipe are respectively communicated with header passages formed in the refrigerant headers, and    the cooling pipes are composed so that a plurality of electronic parts can be interposed between the cooling pipes being arranged in a line in a direction perpendicular to the laminating direction of the cooling pipes and also perpendicular to the passage forming direction of the refrigerant passage.    
   
   
       2 . A lamination-type cooler according to  claim 1 , wherein an overall length of the cooling pipe in the passage forming direction is not more than 100 mm.  
   
   
       3 . A lamination-type cooler according to  claim 1 , wherein an inner fin, the cross section perpendicular to the passage forming direction of which is formed into a wave-form shape, is arranged inside the cooling pipe.  
   
   
       4 . A lamination-type cooler according to  claim 3 , wherein a pitch of the wave-form shape of the inner fin is different in each portion of the inner fin.  
   
   
       5 . A lamination-type cooler according to  claim 4 , wherein a pitch of the wave-form shape of the inner fin is the smallest at a position opposed to an electronic part, the amount of heat generation of which is the largest, in the plurality of electronic parts.  
   
   
       6 . A lamination-type cooler according to one of claims  1 , wherein the refrigerant passage includes a plurality of divided refrigerant passage portions which are formed by being divided in the perpendicular direction corresponding to an arrangement number of arranging the electronic parts.  
   
   
       7 . A lamination-type cooler according to  claim 6 , wherein, in the pair of refrigerant headers, a plurality of supply side refrigerant headers for supplying refrigerant to the cooling pipes are arranged corresponding to a division number of the divided refrigerant passage portions.  
   
   
       8 . A lamination-type cooler according to  claim 7 , wherein cross-sectional areas of the passages of the plurality of supply side refrigerant headers are different from each other.  
   
   
       9 . A lamination-type cooler according to  claim 8 , wherein a header passage of a supply side refrigerant header in the plurality of supply side refrigerant headers, the passage cross-sectional area of which is the largest, is communicated with the divided refrigerant passage portion which is opposed to an electronic part, the amount of heat generation of which the largest.  
   
   
       10 . A lamination-type cooler according to one of claims  7 , wherein the plurality of supply side refrigerant headers branch from one refrigerant introducing pipe.  
   
   
       11 . A lamination-type cooler according to one of claims  1 , wherein the passage forming direction is directed in the perpendicular direction, and a supply side refrigerant header, which is in the pair of refrigerant headers, for supplying refrigerant to the cooling pipe is arranged being directed upward in the perpendicular direction.  
   
   
       12 . A lamination-type cooler comprising: 
 a plurality of cooling pipes for interposing and cooling electronic parts, wherein    the plurality of cooling pipes are laminated on and fixed to each other by a refrigerant supply header for supplying refrigerant to the plurality of cooling pipes and by a refrigerant discharge header for discharging the refrigerant from the plurality of cooling pipes,    one of the refrigerant supply header and the refrigerant discharge header is arranged at both end portions of the plurality of cooling pipes in the refrigerant flowing direction and the other is arranged in an intermediate portion between both end portions in the refrigerant flowing direction, and    the plurality of cooling pipes interpose the electronic parts at positions between the refrigerant supply header and the refrigerant discharge header in the refrigerant flowing direction.    
   
   
       13 . A lamination-type cooler according to  claim 12 , wherein a cross-sectional area of the passage of the refrigerant supply header and a cross-sectional area of the passage of the refrigerant discharge header are different from each other.  
   
   
       14 . A lamination-type cooler according to  claim 12 , wherein an overall cross-sectional area of the passage of the refrigerant supply header and an overall cross-sectional area of the passage of the refrigerant discharge header are equal to each other.  
   
   
       15 . A lamination-type cooler according to one of claims  12 , further comprising: one refrigerant inlet portion which is an inlet of refrigerant to the refrigerant supply header; and one refrigerant outlet portion which is an outlet of refrigerant from the refrigerant discharge header, wherein 
 one of the refrigerant supply header and the refrigerant discharge header respectively arranged at both end portions in the refrigerant flowing direction is communicated with all of the plurality of cooling pipes,    the other of the refrigerant supply header and the refrigerant discharge header arranged in an intermediate portion between both end portions in the refrigerant flowing direction is communicated with the cooling pipes except for one side end portion cooling pipe laminated at the end on one side of the plurality of cooling pipes, and    one of the refrigerant inlet portion and the refrigerant outlet portion is communicated with one side end portion cooling pipe and the other is communicated with the refrigerant supply header or the refrigerant discharge header arranged in an intermediate portion between both end portions in the refrigerant flowing direction.    
   
   
       16 . A lamination-type cooler according to one of claims  12 , wherein a passage width in the perpendicular direction perpendicular to the refrigerant flowing direction of the refrigerant supply header and the refrigerant discharge header is larger than a passage width in the refrigerant flowing direction, and 
 the plurality of cooling pipes interpose a plurality of electronic parts so that the plurality of electronic parts can be arranged in line in the refrigerant flowing direction and the perpendicular direction.