US2006220049A1PendingUtilityA1

Overmolded lens on leadframe and method for overmolding lens on lead frame

Assignee: BARNES GROUP INCPriority: Feb 6, 2004Filed: May 31, 2006Published: Oct 5, 2006
Est. expiryFeb 6, 2024(expired)· nominal 20-yr term from priority
H10W 72/5449H10H 20/8506H10H 20/855
36
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A light emitting diode (LED) assembly including an LED, an optically transmissive cover and a base for supporting the LED. The optically transmissive cover encapsulates the LED and includes a stiffener for reinforcing a base portion of the cover. The base includes electrical leads extending therefrom that are electrically connected to the LED. To make the cover, at least one support frame is formed in a strip of substantially rigid material. The at least one support frame is connected to a processing portion of the strip. At least one lens is overmolded on the at least one support frame that is connected to the processing portion. The overmolded support frame is removed from the processing portion of the strip.

Claims

exact text as granted — not AI-modified
1 . A leadframe strip assembly for LED lens assemblies having lenses and rigid support frames for structurally supporting said lenses, comprising: 
 a leadframe strip;    at least one support frame disposed within said leadframe strip; and    at least one optically transmissive lens formed of a relatively soft material overmolded onto said at least one support frame for structurally supporting said lens.    
   
   
       2 . The leadframe strip assembly of  claim 1  wherein said at least one optically transmissive lens includes a dome portion and a base portion, said base portion being overmolded on said at least one support frame.  
   
   
       3 . The leadframe strip assembly of  claim 2  wherein said at least one optically transmissive lens includes a dome portion and an annular portion, said at least one support frame is annularly shaped and disposed with said annular base portion.  
   
   
       4 . The leadframe strip assembly of  claim 2  wherein said at least one support frame is one of (i) positioned adjacent said base portion and (ii) encased by said base portion.  
   
   
       5 . The leadframe strip assembly of  claim 4  wherein said at least one support frame is entirely encased with said base portion of said at least one optically transmissive lens.  
   
   
       6 . The leadframe strip assembly of  claim 2  wherein said at least one support frame is a ring annularly disposed with said base portion.  
   
   
       7 . The leadframe strip assembly of  claim 2  wherein said at least one optically transmissive lens is formed from a liquid silicone rubber.  
   
   
       8 . The leadframe strip assembly of  claim 2  wherein said base portion extends radially outwardly from said dome portion.  
   
   
       9 . The leadframe strip assembly of  claim 8  wherein said at least one support frame is annularly received around said dome portion and against an upper surface of said radially extending base portion.  
   
   
       10 . The leadframe strip assembly of  claim 8  wherein said at least one support frame is encapsulated entirely by said radially extending base portion.  
   
   
       11 . The leadframe strip assembly of  claim 1  wherein said at least one support frame includes two support frames each having an optically transmissive lens overmolded thereon, said two support frames connected to a processing portion of said leadframe strip by supports.  
   
   
       12 . The leadframe strip assembly of  claim 11  wherein said processing portion includes recesses for aligning with pins during overmolding of said support frames.  
   
   
       13 . The leadframe strip assembly of  claim 1  wherein said leadframe strip and said at least one support frame are stainless steel.  
   
   
       14 . The leadframe strip assembly of  claim 1  wherein said leadframe strip and said at least one support frame are integrally formed of a material that is relatively harder than said at least one optically transmissive lens for providing dimensional stability to said at least one optically transmissive cover.  
   
   
       15 . A leadframe strip assembly for use in manufacturing LED lens assemblies, comprising: 
 a leadframe strip including a plurality of support frames; and    a plurality of lens covers having a base portion and a dome portion integrally formed with said base portion, said dome portion being at least partially optically transmissive to allow light from an LED to pass therethrough, each of said plurality of support frames reinforcing said base portion of a corresponding one of said plurality of lens covers for providing structural integrally to said corresponding one of said plurality of lens covers.    
   
   
       16 . The leadframe strip assembly of  claim 15  wherein each of said plurality of lens covers is formed of a relatively soft material and each of said plurality of support frames is formed of a material that is relatively harder than that of said plurality of lens covers for providing dimensional stability.  
   
   
       17 . The leadframe strip assembly of  claim 16  wherein said relatively soft material is silicone and said material that is relatively harder is stainless steel.  
   
   
       18 . The leadframe assembly of  claim 15  wherein said dome portion is formed of a substantially transparent material.  
   
   
       19 . A method of manufacturing a plurality of LED lens assemblies on a leadframe strip for use in an LED assembly, comprising the steps of: 
 providing a strip of rigid material;    forming at least one support frame in said strip that is connected to a processing portion of said strip;    overmolding at least one lens on said at least one support frame that is connected to said processing portion; and    removing the overmolded support frame from said processing portion of said strip.    
   
   
       20 . The method of  claim 19  further including: 
 using said overmolded support frame to encapsulate an LED.    
   
   
       21 . The method of  claim 19  wherein said steps of removing and using said overmolded support frame includes the sub-steps of: 
 using a vacuum pick and place to remove said overmolded support frame from said processing portion of said strip; and    using said vacuum pick and place to encapsulate said LED with the removed overmolded support frame.

Join the waitlist — get patent alerts

Track US2006220049A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.