US2006225874A1PendingUtilityA1

Sandwiched thermal article

Assignee: SHIVES GARY DPriority: Apr 11, 2005Filed: Apr 11, 2005Published: Oct 12, 2006
Est. expiryApr 11, 2025(expired)· nominal 20-yr term from priority
H10W 40/255H10W 40/25F28F 21/02F28D 2021/0029
36
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Claims

Abstract

A thermal material for heat dissipation, which includes at least one sheet of flexible graphite sandwiched about a non-graphite core layer.

Claims

exact text as granted — not AI-modified
1 . A thermal dissipation article, comprising at least two sheets of graphite sandwiched about a core layer, capable of use for thermal dissipation.  
     
     
         2 . The article of  claim 1 , wherein the core layer comprises materials selected from the group consisting of plastics, metals, and composites or combinations thereof.  
     
     
         3 . The article of  claim 2 , wherein the core layers comprises a metallic material.  
     
     
         4 . The article of  claim 3 , wherein the metallic material is tanged or a mesh.  
     
     
         5 . The article of  claim 3 , wherein the core layer comprises aluminum.  
     
     
         6 . The article of  claim 1 , wherein a portion of the core layer extends beyond an edge of at least one of the sheets of graphite.  
     
     
         7 . The article of  claim 1 , further comprising a heat collection article with which the article is in operative contact.  
     
     
         8 . The article of  claim 7 , wherein the heat dissipation device comprises a heat sink, a heat pipe, a heat plate or any combination thereof.  
     
     
         9 . The article of  claim 1 , which is in operative contact with a heat source.  
     
     
         10 . The article of  claim 9 , wherein the core layer is in direct operative contact with the heat source.  
     
     
         11 . The article of  claim 1 , which has an in-plane thermal conductivity of at least about 140 W/m° K.  
     
     
         12 . The article of  claim 11 , which has a through-plane thermal conductivity of no greater than about 12 W/m° K.  
     
     
         13 . A finstock for an electronic device thermal dissipation system, comprising a core layer sandwiched between at least two sheets of graphite.  
     
     
         14 . The finstock of  claim 13 , wherein the core layer comprises materials selected from the group consisting of plastics, metals, and composites or combinations thereof.  
     
     
         15 . The finstock of  claim 14 , wherein the core layer comprises a metallic material.  
     
     
         16 . The finstock of  claim 15 , wherein the metallic material is tanged or a mesh.  
     
     
         17 . The finstock of  claim 13 , wherein a portion of the core layer extends beyond an edge of at least one of the sheets of graphite.  
     
     
         18 . The finstock of  claim 15 , wherein the core layer comprises aluminum.  
     
     
         19 . The finstock of  claim 13 , which has an in-plane thermal conductivity of at least about 140 W/m° K.  
     
     
         20 . The finstock of  claim 19 , which has a through-plane thermal conductivity of no greater than about 12 W/m° K.

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