Apparatus for cooling computer parts and method of manufacturing the same
Abstract
Provided is an apparatus for cooling a computer part that generates heat installed in a computer. The apparatus includes a heat transferring block thermally coupled to the heat generating parts to receive the heat generated by the heat dissipating parts; at least one heat pipe including a heat transferring block coupling portion thermally coupled to the heat transferring block and a heat dissipating fin coupling portion bent into a curved shape; and a plurality of heat dissipating fins coupled to the heat dissipating fin coupling portion of the heat pipe and spaced apart from each other along to the heat dissipating fin coupling portion.
Claims
exact text as granted — not AI-modified1 . An apparatus for cooling a heat generating computer part installed in a computer, the apparatus comprising:
a heat transferring block thermally coupled to the heat generating parts to conduct the heat generated by the heat dissipating parts; at least one heat pipe including a heat transferring block coupling portion thermally coupled to the heat transferring block and a heat dissipating fin coupling portion bent into a curved shape; and a plurality of heat dissipating fins coupled to the heat dissipating fin coupling portion of the heat pipe and spaced apart from each other along to the heat dissipating fin coupling portion.
2 . The apparatus of claim 1 , wherein the heat transferring block coupling portion of the heat pipe is at least one of both ends of the heat pipe, and
the heat dissipating fin coupling portion is at least a part of an intermediate portion between the ends of the heat pipe.
3 . The apparatus of claim 1 , wherein the heat transferring block coupling portion of the heat pipe is an intermediate portion of the heat pipe, and
the heat dissipating fin coupling portion is at least part of the heat pipe extending from respective ends of the heat transferring block coupling portion.
4 . The apparatus of claim 1 , wherein the heat transferring block coupling portion of the heat pipe has a substantially circular arc shape or a partial oval shape.
5 . The apparatus of claim 1 , wherein each of the heat dissipating fins is formed of a thin metal plate, and is disposed on the heat dissipating fin coupling portion so that spaces between ends of the heat dissipating fins on the inside of the heat dissipating fin coupling portion are smaller than spaces between ends of the heat dissipating fins on the outside of the heat dissipating fin coupling portion.
6 . The apparatus of claim 1 , wherein the heat dissipating fin coupling portion forms a circular shape as a whole, each of the heat dissipating fins is formed of a thin metal plate, and the heat dissipating fins are arranged to extend radially from the heat dissipating fin coupling portion to substantially form a cylindrical shape in appearance.
7 . The apparatus of claim 1 , wherein each of the heat dissipating fins is made of a thin metal member and forms a partial wave shape.
8 . The apparatus of claim 1 , wherein each of the heat dissipating fins comprises a perforation hole through which the heat dissipating fin coupling portion of the heat pipe passes, and the heat dissipating fin coupling portion and the heat dissipating fins are soldered to each other.
9 . The apparatus of claim 1 , wherein a virtual plane in which the heat dissipating fin coupling portion is formed is at right angles to or parallel to the upper surface of the heat transferring block.
10 . The apparatus of claim 1 , further comprising: a cooling fan including a center driving portion including a motor and a plurality of blade portions that are formed at the circumferential surface of the center driving portion and produce an air current during rotating.
11 . The apparatus of claim 10 , wherein an axis of rotation of the center driving portion of the cooling fan passes through the heat dissipating fin coupling portion and the blade portions blow the air into the spaces between the heat dissipating fins coupled to the heat dissipating fin coupling portion, and
the heat dissipating fins are coupled to the heat dissipating fin coupling portion so as to form an empty space on a downside of the center driving portion of the cooling fan.
12 . The apparatus of claim 11 , wherein the heat dissipating fin coupling portion substantially forms a circular arc, and
the heat dissipating fins are arranged in the center of the heat dissipating fin coupling portion so as to form an empty space into which a virtual circle formed by the circumferential surface of the center driving portion of the cooling fan can be inserted.
13 . The apparatus of claim 10 , further comprising: a duct member surrounding the heat dissipating fins and open at two ends through which the air current produced by the cooling fan blows.
14 . The apparatus of claim 10 , wherein the heat dissipating fin coupling portion substantially forms a circular arc shape and the heat dissipating fins form a cylindrical shape as a whole, and
each of the heat dissipating fins includes a duct forming portion that is formed by bending at least a part of its exterior end and forms a duct portion at the exterior surface of the cylindrical shaped heat dissipating fins.
15 . The apparatus of claim 10 , wherein a concave portion is formed at each of the heat dissipating fins so that a concave portion housing the cooling fan is formed at the heat dissipating fins.
16 . The apparatus of claim 10 , wherein the heat dissipating fin coupling portion substantially forms a circular arc, and
the heat dissipating fins form an air path having a spiral shape following a direction of rotation of the cooling fan so that an airflow produced by the cooling fan can maintain a spiral shape with respect to the rotating center axis.
17 . The apparatus of claim 16 , wherein the ends of each of the heat dissipating fins at opposing ends of the axis of the cooling fan are bent in rotationally opposite direction with respect to the axis of the cooling fan.
18 . The apparatus of claim 10 , wherein a virtual plane in which the heat dissipating fin coupling portion of each heat pipe forms an acute angle with the upper surface of the heat transferring block.
19 . The apparatus of claim 1 , wherein the heat generating part is a central processing unit (CPU) mounted in a main board of the computer.
20 . The apparatus of claim 1 , wherein the heat generating part is a chipset mounted in a substrate of a graphic adapter installed in the main board of the computer.
21 . The apparatus of claim 20 , wherein the heat transferring block is tightly coupled to the chipset, and
the heat dissipating fin coupling portion and the heat transferring block are formed opposite to each other with respect to substrate.
22 . A method of manufacturing an apparatus for dissipating heat generating computer parts in which the apparatus comprises a heat transferring block thermally coupled to a heat generating part to conduct the heat generated by the heat dissipating parts; at least one heat pipe including a heat transferring block coupling portion thermally coupled to the heat transferring block and a heat dissipating fin coupling portion bent into a curved shape; and a plurality of heat dissipating fins coupled to the heat dissipating fin coupling portion of the heat pipe, including a inserted portion through which the heat dissipating fin coupling portion is inserted, and spaced apart from each other along to the heat dissipating fin coupling portion to cool the heat generating part that generates heat, the method comprising:
preparing a rectilinear type heat pipe and a plurality of heat dissipating fins in which inserted holes are formed; inserting the heat pipe into the heat dissipating fins through the inserted holes and arranging the heat dissipating fins to be spaced apart from each other; and forming the heat dissipating fin coupling portion by bending a part of the heat pipe on which the heat dissipating fins are to be disposed.
23 . The method of claim 22 , further comprising:
coating a cream solder on a part of the heat pipe that contacts the circumferential surface of the perforation hole of each of the heat dissipating fins; and forming a soldering portion that couples the heat pipe and each of the heat dissipating fins.
24 . The method of claim 23 , wherein the cream solder is coated before the heat dissipating fin coupling portion is formed, and
the soldering portion is formed after the heat dissipating fin coupling portion is formed.Join the waitlist — get patent alerts
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