Bonding pad for a packaged integrated circuit

Abstract

An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.

1 - 18 . (canceled)  
     
     
         19 . A package substrate for an integrated circuit, comprising: 
 a top traceless surface;    a bottom traceless surface;    a plurality of vias in the package substrate extending between the top and bottom traceless surfaces;    a plurality of via capture pads arranged on the top traceless surface, wherein each of the via capture pads surrounds a respective one of the vias and each via capture pad includes: 
 a land area;  
 a clearance area surrounding the land area; and  
 a photo mask surrounding the clearance area; and  
   wherein each via capture pad includes at least one sharp edge that assists a pattern recognition system of a wire bonder in locating at least one bond wire on the via capture pad.    
     
     
         20 . The package substrate of  claim 19 , wherein the integrated circuit is electrically coupled to the plurality of vias using a plurality of traceless conductors.  
     
     
         21 . The package substrate of  claim 20 , wherein the plurality of traceless conductors comprises a plurality of insulated wires.  
     
     
         22 . The package substrate of  claim 19 , wherein the package substrate is a ball grid array (BGA) substrate.  
     
     
         23 . (canceled)  
     
     
         24 . The package substrate of  claim 19 , wherein each clearance area comprises BT.  
     
     
         25 . (canceled)  
     
     
         26 . The package substrate of  claim 19 , further comprising a plurality of plugs located in respective ones of the plurality of vias.  
     
     
         27 . The package substrate of  claim 19 , wherein all of the via capture pads are rectangular shaped and have varying numbers of cut-outs therein.  
     
     
         28 . The package substrate of  claim 19 , wherein each land area comprises a conductive metal.  
     
     
         29 . The package substrate of  claim 28 , wherein the conductive metal comprises one of copper, gold, silver and aluminum.  
     
     
         30 . The package substrate of  claim 19 , wherein the vias are arranged in an array.