Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor

Abstract

Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R 1 and R 2 each represent independently an alkyl group having 1 to 5 carbon atoms).

1 - 31 . (canceled)  
   
   
       32 . An electric fixing apparatus characterized by using polyimide as a layer insulating film, wherein the polyimide is represented by Formula (4):  
     
       
         
         
             
             
         
       
       (wherein A represents a tetravalent organic group; R represents a tetravalent organic group having 1 to 20 carbon atom; and n represents an integer of 0 to 3).  
     
   
   
       33 . An electric fixing apparatus of  claim 32 , wherein A in Formula (4) is an adamantane skeleton.  
   
   
       34 . (canceled)  
   
   
       35 . An electric fixing apparatus of  claim 32 , wherein B in Formula (4) is benzene ring or a biphenyl ring.  
   
   
       36 . An electric fixing apparatus of  claim 33 , wherein B in Formula (4) is a benzene ring or a biphenyl ring.  
   
   
       37 . (canceled)  
   
   
       38 . An electric fixing apparatus characterized by using polyimide as a layer insulating film, wherein the polyimide has a three-dimensional structure represented by Formula (3):  
     
       
         
         
             
             
         
       
     
   
   
       39 - 40 . (canceled)  
   
   
       41 . An electric fixing apparatus characterized by using polyimide as a layer insulating film polyimide, wherein the polyimide is represented by Formula (5):