Resin packaging

Abstract

This invention relates to packages, systems, and methods for protecting rosin-based resins, modified rosin resins, hydrocarbon resins and hydrocarbon modified resins suitable for use in the production of printing inks and other coatings from the effects of exposure to oxygen during transport and storage. In particular, this method involves the packaging of rosin-based resins, modified rosin resins, hydrocarbon resins and/or hydrocarbon modified resins at a temperature at least 5° F. below the glass transition temperature of the resin being packaged in sealed oxygen-transmission resistant enclosures from which a substantial portion of the oxygen has been evacuated.

1 . A method for packaging resin, comprising the steps of: 
 a) providing resin selected from the group consisting of rosin-based resins, modified rosin resins, hydrocarbon resins, hydrocarbon modified resins, and combinations thereof;    b) placing said resin in one or more oxygen-transmission resistant, flexible packaging enclosures wherein each enclosure has at least one sealable opening therein;    c) subjecting the packaging enclosures and said resin to a vacuum force to remove a substantial portion of the oxygen from the packaging enclosures; and    d) sealing the flexible packaging enclosures while subjected to the vacuum force such that upon sealing the packaging enclosure contains an oxygen-reduced atmosphere, and wherein said resin has a temperature at least 5° F. below its glass transition temperature at the time of sealing.    
   
   
       2 . The method of  claim 1  wherein the resin is flaked.  
   
   
       3 . The method of  claim 1  wherein the resin has a temperature of less than about 100° F.  
   
   
       4 . The method of  claim 1  wherein the resin has a temperature of less than about 70° F.  
   
   
       5 . The method of  claim 1  wherein the packing enclosure has an oxygen transmission rate of less than about 200 cubic centimeters per square meter per day at atmospheric pressure.  
   
   
       6 . The method of  claim 1  wherein the packing enclosure has a moisture vapor transmission rate of less than about 90 grams per square meter per day at atmospheric pressure.  
   
   
       7 . A package for resins comprising a sealed, oxygen-transmission resistant enclosure surrounding at least one resin selected from the group consisting of rosin-based resins, modified rosin resins, hydrocarbon resins, hydrocarbon modified resins, and combinations thereof, wherein said resin has a temperature at least 5° F. below its glass transition temperature at the time the enclosure is sealed and wherein said package had a substantial portion of the oxygen evacuated from said package at the time the enclosure is sealed to produce an oxygen-reduced atmosphere in the package.  
   
   
       8 . The package of  claim 7  wherein the resin is flaked.  
   
   
       9 . The package of  claim 7  wherein the resin has a temperature of less than about I 00° F. at the time the enclosure is sealed.  
   
   
       10 . The package of  claim 7  wherein the resin has a temperature of less than about 70° F. at the time the enclosure is sealed.  
   
   
       11 . The package of  claim 7  wherein the enclosure has an oxygen transmission rate of less than about 200 cubic centimeters per square meter per day at atmospheric pressure.  
   
   
       12 . The package of  claim 7  wherein the enclosure has a moisture vapor transmission rate of less than about 90 grams per square meter per day at atmospheric pressure.  
   
   
       13 . A system for packaging at least one resin selected from the group consisting of rosin-based resins, modified rosin resins, hydrocarbon resins and hydrocarbon modified resins and combinations thereof comprising: 
 a) means for forming a sealed, oxygen-transmission resistant enclosure around said resin, and    b) means for evacuating a substantial portion of the oxygen from said enclosure prior to sealing of said enclosure to produce an oxygen-reduced atmosphere within said enclosure at a time when the enclosed resin has a temperature at least 5° F. below its glass transition temperature.    
   
   
       14 . The system of  claim 13  wherein the resin is flaked.  
   
   
       15 . The system of  claim 13  wherein the resin has a temperature of less than about 1 00° F. at the time the enclosure is sealed.  
   
   
       16 . The system of  claim 13  wherein the resin has a temperature of less than about 70° F. at the time the enclosure is sealed.  
   
   
       17 . The system of  claim 13  wherein the enclosure has an oxygen transmission rate of less than about 200 cubic centimeters per square meter per day at atmospheric pressure.  
   
   
       18 . The system of  claim 13  wherein the enclosure has a moisture vapor transmission rate of less than about 90 grams per square meter per day at atmospheric pressure.