Multilayer valve structures, methods of making, and pumps using same

Abstract

A multilayer valve subassembly ( 50 ) comprises an interface layer ( 60 ) having an interface layer flap ( 62, 64 ); a cover layer ( 70 ) having a cover layer flap ( 72, 74 ); and, an intermediate layer ( 80 ) positioned between the interface layer and the cover layer. The intermediate layer ( 80 ) has an intermediate layer flap ( 82, 84 ) essentially aligned with the interface layer flap and the cover layer flap. A first bond ( 102 ) adheres the cover layer ( 70 ) to the interface layer ( 60 ); a flap bond ( 92, 94 ) seals the interface layer flap ( 82, 84 ) between the cover layer flap ( 72, 74 ) and the interface layer flap ( 62, 64 ) and thereby forms a multilayer valve flap ( 52, 54 ) which is insulated from fluid which travels through the valve. In an example embodiment, the each of the interface layer flap, the cover layer flap, and the interface layer flap has a substantially U-shape. Preferably the interface layer is not in contact with the first bond or the second bond and has a size that permits the interface layer to float in a sandwich pocket formed between the interface layer and the cover layer.

1 . A multilayer valve subassembly comprising: 
 an interface layer having an interface layer flap;    a cover layer having a cover layer flap;    an intermediate layer positioned between the interface layer and the cover layer, the intermediate layer having an intermediate layer flap essentially aligned with the interface layer flap and the cover layer flap;    a first bond for adhering the cover layer to the interface layer;    a flap bond for sealing the interface layer flap between the cover layer flap and the interface layer flap and thereby forming a multilayer valve flap.    
   
   
       2 . The apparatus of  claim 1 , wherein the each of the interface layer flap, the cover layer flap, and the interface layer flap has a substantially U-shape.  
   
   
       3 . The apparatus of  claim 1 , wherein at least one of the first bond and the second bond is an electromagnetic bond formed by absorption of electromagnetic energy.  
   
   
       4 . The apparatus of  claim 1 , wherein the interface layer is not in contact with the first bond or the second bond and has a size that permits the interface layer to float in a pocket formed between the interface layer and the cover layer.  
   
   
       5 . The apparatus of  claim 1 , wherein the intermediate layer serves as a stabilizing or stiffener layer.  
   
   
       6 . The apparatus of  claim 1 , wherein the intermediate layer comprises an electroconductive metal.  
   
   
       7 . The apparatus of  claim 1 , wherein the cover layer comprises an elastomer.  
   
   
       8 . The apparatus of  claim 1 , wherein the interface layer has an interface layer first flap and an interface layer second flap; wherein the intermediate layer has an intermediate layer first flap and an intermediate layer second flap; wherein the cover layer has a cover layer first flap and a cover layer second flap; and further comprising: 
 a first flap bond for bonding the first flap of the interface layer to the first flap of the cover layer whereby the first flap of the intermediate layer sandwiched between the first flap of the interface layer and the first flap of the cover layer forms a first valve flap;    a second flap bond for bonding the second flap of the interface layer to the second flap of the cover layer whereby the second flap of the intermediate layer sandwiched between the second flap of the interface layer and the second flap of the cover layer forms a second valve flap.    
   
   
       9 . The apparatus of  claim 8 , wherein the intermediate layer first flap and the intermediate layer second flap are electrically isolated.  
   
   
       10 . The apparatus of  claim 8 , wherein the first valve flap is centrally formed with respect to the interface layer, the intermediate layer, and the cover layer.  
   
   
       11 . The apparatus of  claim 1 , wherein a multilayer structure formed by the bonding of the cover layer to the interface layer has a footprint which is substantially equal to a pump footprint.  
   
   
       12 . The apparatus of  claim 1 , wherein a multilayer structure formed by the bonding of the cover layer to the interface layer has an essentially circular shape.  
   
   
       13 . A method of fabricating a valve subassembly comprising: 
 forming flaps in each of an interface layer, an intermediate layer, and a cover layer;    positioning the intermediate layer between the interface layer and the cover layer;    bonding the flap of the interface layer to the flap of the cover layer whereby a valve flap is formed, the valve flap being comprised of the flap of the intermediate layer sandwiched and sealed between the flap of the interface layer and the flap of the cover layer.    
   
   
       14 . The method of  claim 13 , further comprising: 
 forming at least one of the interface layer and the cover layer from an electromagnetically transmissive material;    electromagnetically welding the flap of the interface layer to the flap of the cover layer.    
   
   
       15 . The method of  claim 13 , wherein the shape of the valve flap is essentially U shaped.  
   
   
       16 . The method of  claim 13 , further comprising forming the intermediate layer from an electroconductive metal  
   
   
       17 . The method of  claim 13 , further comprising forming the cover layer from an elastomer.  
   
   
       18 . The method of  claim 13 , further comprising: 
 forming two flaps in each of the interface layer, the intermediate layer, and the cover layer, whereby the interface layer has an interface layer first flap and an interface layer second flap; wherein the intermediate layer has an intermediate layer first flap and an intermediate layer second flap; wherein the cover layer has a cover layer first flap and a cover layer second flap;    bonding the first flap of the interface layer to the first flap of the cover layer for forming a first valve flap, the first valve flap comprising the first flap of the intermediate layer sandwiched between the first flap of the interface layer and the first flap of the cover layer;    bonding the second flap of the interface layer to the second flap of the cover layer for forming a second valve flap, the second valve flap comprising the second flap of the intermediate layer sandwiched between the second flap of the interface layer and the second flap of the cover layer.    
   
   
       19 . The method of  claim 18 , further comprising electrically isolating the intermediate layer first flap and the intermediate layer second flap.  
   
   
       20 . The method of  claim 18 , further comprising centrally forming the first valve flap with respect to the interface layer, the intermediate layer, and the cover layer.  
   
   
       21 . The method of  claim 13 , further comprising forming a multilayer structure by bonding of the cover layer to the interface layer to have a footprint which is substantially equal to a pump footprint.  
   
   
       22 . A pump comprising: 
 a pump base member having a first surface and a second surface and at least one port;    a diaphragm covering at least a portion of the first surface of the pump base member and defining a pumping chamber between the pump base member and the diaphragm layer;    a multilayer valve subassembly positioned on the second surface of the pump base member for selectively communicating fluid through the port, the multilayer valve subassembly comprising: 
 an interface layer having an interface layer flap;  
 a cover layer having a cover layer flap;  
 an intermediate layer positioned between the interface layer and the cover layer, the intermediate layer having an intermediate layer flap essentially aligned with the interface layer flap and the cover layer flap;  
 a first bond for adhering the cover layer to the interface layer;  
 a flap bond for sealing the interface layer flap between the cover layer flap and the interface layer flap and thereby forming a multilayer valve flap.  
   
   
   
       23 . The apparatus of  claim 22 , wherein the each of the interface layer flap, the cover layer flap, and the interface layer flap has a substantially U-shape.  
   
   
       24 . The apparatus of  claim 22 , wherein at least one of the first bond and the second bond is an electromagnetic bond formed by absorption of electromagnetic energy.  
   
   
       25 . The apparatus of  claim 22 , wherein the interface layer is not in contact with the first bond or the second bond and has a size that permits the interface layer to float in a pocket formed between the interface layer and the cover layer.  
   
   
       26 . The apparatus of  claim 22 , wherein the intermediate layer serves as a stabilizing or stiffener layer.  
   
   
       27 . The apparatus of  claim 22 , wherein the intermediate layer comprises an electroconductive metal.  
   
   
       28 . The apparatus of  claim 22 , wherein the cover layer comprises an elastomer.  
   
   
       29 . The apparatus of  claim 22 , wherein the interface layer has an interface layer first flap and an interface layer second flap; wherein the intermediate layer has an intermediate layer first flap and an intermediate layer second flap; wherein the cover layer has a cover layer first flap and a cover layer second flap; and further comprising: 
 a first flap bond for bonding the first flap of the interface layer to the first flap of the cover layer whereby the first flap of the intermediate layer sandwiched between the first flap of the interface layer and the first flap of the cover layer forms a first valve flap;    a second flap bond for bonding the second flap of the interface layer to the second flap of the cover layer whereby the second flap of the intermediate layer sandwiched between the second flap of the interface layer and the second flap of the cover layer forms a second valve flap.    
   
   
       30 . The apparatus of  claim 29 , wherein the intermediate layer first flap and the intermediate layer second flap are electrically isolated.  
   
   
       31 . The apparatus of  claim 29 , wherein the first valve flap is centrally formed with respect to the interface layer, the intermediate layer, and the cover layer.  
   
   
       32 . The apparatus of  claim 22 , wherein a multilayer structure formed by the bonding of the cover layer to the interface layer has a footprint which is substantially equal to a footprint of the pump base member.