Wiring board, multilayer wiring board, and method for manufacturing the same

Abstract

A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

1 . A method for manufacturing a wiring board comprising an insulating member, comprising: 
 forming a penetrating hole in the insulating member;    inserting a conductive connecting particle into the penetrating hole;    disposing conductive layers on both surfaces of the insulating member    pressing the conductive layers toward the connecting particle in the penetrating hole to deform the connecting particle in the pressing direction to obtain a connecting member; and    patterning the conductive layers,    wherein the pressing is performed such that a cross-sectional area in a direction along a surface of the insulating member of at least a portion of the connecting member is greater than a contact area of the connecting member with the conductive layers.    
   
   
       2 . The method for manufacturing a wiring board according to  claim 1 , wherein the dimension of the connecting particles in a thickness direction of the insulating member is larger than a thickness of the insulating member.  
   
   
       3 . The method for manufacturing a wiring board according to  claim 1 , wherein after the pressing process, a contact area of the connecting member with the conductive layers is greater than a contact area of the connecting particle with the conductive layers prior to the pressing process.  
   
   
       4 . The method for manufacturing a wiring board according to  claim 1 , wherein the penetrating hole is formed such that an inner diameter at one end is greater than the connecting particle, and an inner diameter at the other end is smaller than the connecting particle.  
   
   
       5 . A method for manufacturing a multilayer wiring board, the method comprising: 
 manufacturing a wiring board by a method comprising: 
 forming a penetrating hole in an insulating member;  
 inserting a conductive connecting particle into the penetrating hole;  
 disposing conductive layers on both surfaces of the insulating member  
 pressing the conductive layers toward the connecting particle in the penetrating hole to deform the connecting particle in the pressing direction to obtain a connecting member; and  
 patterning the conductive layers;  
   placing an outer-layer wiring substrate on a surface of the manufactured wiring board; and    pressing the outer-layer wiring substrate toward the wiring board,    wherein a pressing pressure in the pressing of the outer-layer wiring substrate is lower than a pressing pressure in the pressing of the connecting particle.    
   
   
       6 . The method for manufacturing a multilayer wiring board according to  claim 5 , further comprising placing another outer-layer wiring substrate on another surface of the manufactured wiring board, wherein pressing the outer layer wiring substrate comprises pressing both outer-layer wiring substrates toward the wiring board, wherein a dimension of the connecting particle in a thickness direction of the insulating member is larger than a thickness of the insulating member.  
   
   
       7 . The method for manufacturing a multilayer wiring board according to  claim 5 , wherein the outer-layer wiring substrates comprise an outer-layer side conductive layer of copper foil on one surface of the insulating layer having an opening, and the opening is filled with conductive paste so as to effect connection to the outer layer-side conductive layer.  
   
   
       8 . The method for manufacturing a multilayer wiring board according to  claim 5 , wherein the pressing of the conductive layers toward the connecting particle is performed such that a cross-sectional area in a direction along a surface of the insulating member of at least a portion of the connecting member is greater than a contact area of the connecting member with the conductive layers.  
   
   
       9 . The method for manufacturing a multilayer wiring board according to  claim 5 , wherein after the pressing process, a contact area of the connecting member with the conductive layers is greater than a contact area of the connecting particle with the conductive layers prior to the pressing process.  
   
   
       10 . The method for manufacturing a multilayer wiring board according to  claim 5 , wherein the penetrating hole is formed such that an inner diameter at one end is greater than the connecting particle, and the inner diameter at the other end is smaller than the connecting particle.  
   
   
       11 . A wiring board, comprising: 
 an insulating member having a penetrating hole;    conductive layers formed on a top and a bottom surface of the insulating member; and    a conductive connecting member provided in the penetrating hole to connect the conductive layers together;    wherein at least a portion of the connecting member has a cross-sectional area in a direction along a surface of the insulating member that is greater than an area of contact with at least one of the conductive layers.    
   
   
       12 . A multilayer wiring board, comprising: 
 an outer-layer wiring substrate stacked onto at least one surface of the wiring board according to  claim 6 ,    wherein the outer-layer wiring substrate comprises an outer layer-side conductive layer of silver foil on one surface of an insulating layer having an opening, and the opening is filled with a conductive paste so as to be connected to the outer layer-side conductive layer.    
   
   
       13 . The method for manufacturing a multilayer wiring board according to  claim 5 , further comprising patterning a wire pattern on the outer layer wiring substrate prior to pressing the outer-layer wiring substrate toward the wiring board.