Method For Packaging Flash Memory Cards

Abstract

A method for packaging flash memory cards is provided, including the steps of forming a shell base, placing a circuit substrate inside the shell base with electric contact parts exposed, and using insert molding to form a monolithic shell to enclose the circuit substrate. The electric contacts parts of the circuit substrate remain exposed. The method provides a stronger structure for memory cards, and better water-proof against humidity leakage.

1 . A method for packaging flash memory cards, comprising the steps of: 
 forming a shell base;    placing a circuit substrate inside said shell base, with a plurality of electric contact parts on said circuit substrate surface uncovered;    placing said shell base inside a mold and using insert molding to form a monolithic shell with said shell base so that the monolithic shell enclosing the top surface, bottom surface and the circumference of said circuit substrate with only said electric contact parts exposed.    
   
   
       2 . The method as claimed in  claim 1 , wherein said insert molding step is to flow a molding material over the top and the circumference of said circuit substrate to infuse with said shell base to form said monolithic shell enclosing said circuit substrate.  
   
   
       3 . The The method as claimed in  claim 1 , wherein the top surface of said shell base comprises a concave space for housing said circuit substrate.  
   
   
       4 . The method as claimed in  claim 1 , wherein said circuit substrate is a printed circuit board (PCB) with complete electric connections.  
   
   
       5 . The method as claimed in  claim 1 , wherein said method is applied to an SD card or mini SD card.  
   
   
       6 . The method as claimed in  claim 1 , wherein said method is applied to an MMC card or MMC plus card.  
   
   
       7 . The method as claimed in  claim 1 , wherein said method is applied to an SM card.  
   
   
       8 . The method as claimed in  claim 1 , wherein said method is applied to an MS card.  
   
   
       9 . The method as claimed in  claim 1 , wherein said method is applied to an xD-Picture card.  
   
   
       10 . The method as claimed in  claim 1 , wherein said method is applied to a CF card.