Matching dose and energy of multiple ion implanters

Abstract

A method that is sensitive to lattice damage (also called “primary method”) is combined with an additional method that independently measures one of two parameters to which the primary method is sensitive namely dose and energy. In some embodiments, the additional method is sensitive to dose, and in two such embodiments 4PP and SIMS are respectively used to measure dose (independent of energy). In other embodiments, the additional method is sensitive to energy, and in one such embodiment SIMS is used to measure energy (independent of dose). Use of such an additional method resolves an ambiguity in a prior art measurement by the primary method alone. The two methods are used in combination in some embodiments, to determine adjustments needed to match two or more ion implanters to one another or to a reference ion implanter or to a computer model.

1 . A method of adjusting an ion implanter, the method comprising: 
 evaluating a first wafer using a first method that is sensitive to a first parameter selected from a group consisting of dose and energy, the first method measuring the first parameter independent of a second parameter in said group;    determining a first adjustment in the first parameter based at least on a first measurement obtained from said evaluating of first wafer;    evaluating a second wafer using a second method that is sensitive to both the first parameter and the second parameter, wherein the second wafer is implanted by said ion implanter after said first adjustment is made; and    determining a second adjustment in the second parameter based at least on a second measurement obtained from said evaluating of the second wafer.    
   
   
       2 . The method of  claim 1  wherein: 
 the first parameter is dose and the second parameter is energy.    
   
   
       3 . The method of  claim 2  wherein: 
 the first method uses a four point probe (4PP) apparatus to measure dose during said evaluating.    
   
   
       4 . The method of  claim 2  wherein: 
 the first method uses secondary ion mass spectrometry (SIMS) to measure dose during said evaluating.    
   
   
       5 . The method of  claim 2  wherein: 
 the second method uses a carrier wave.    
   
   
       6 . The method of  claim 2  wherein: 
 the second method uses carrier illumination.    
   
   
       7 . The method of  claim 2  wherein the ion implanter is hereinafter “second ion implanter” and the method comprises: 
 using a first ion implanter to implant a plurality of reference wafers at a corresponding plurality of doses;    evaluating the reference wafers using the first method to obtain calibration data for the first method;    evaluating the reference wafers using the second method to obtain calibration data for the second method;    before said evaluating of the first wafer, implanting the first wafer by using the second ion implanter set to said predetermined value of the first parameter;    wherein said determining of first adjustment comprises using the first measurement with the calibration data for the first method to determine a first dose, and comparing said first dose with said first measurement to identify said first adjustment;    making the first adjustment on the second ion implanter; and    before said evaluating of the second wafer, implanting the second wafer with the second ion implanter after said first adjustment is made;    wherein said determining of second adjustment comprises using the second measurement with the calibration data for the second method to identify said second adjustment.    
   
   
       8 . The method of  claim 1  wherein: 
 the first parameter is energy and the second parameter is dose.    
   
   
       9 . The method of  claim 8  wherein: 
 the first method uses secondary ion mass spectrometry (SIMS) to measure energy during said evaluating.    
   
   
       10 . The method of  claim 9  wherein: 
 the second method uses a carrier wave.    
   
   
       11 . The method of  claim 9  wherein: 
 the second method uses carrier illumination.    
   
   
       12 . The method of  claim 1  further comprising: 
 implanting the first wafer with the ion implanter before said evaluating of the first wafer;    making the first adjustment on the ion implanter; and    implanting the second wafer with the ion implanter after said first adjustment is made.    
   
   
       13 . The method of  claim 1  wherein: 
 the first method uses a dose measurement technique during said evaluating.    
   
   
       14 . The method of  claim 1  further comprising: 
 using said ion implanter at nominal dose and nominal energy to implant a third wafer;    storing the third wafer unprocessed while implanting a plurality of wafers using said ion implanter at nominal dose and nominal energy and further processing said plurality of wafers;    wherein said evaluatings and determinings are performed subsequent to said storing; and    wherein at least one of said determinings uses calibration data from said third wafer.    
   
   
       15 . A method of adjusting an ion implanter, the method comprising: 
 evaluating a first wafer using a dose-sensitive method;    determining an adjustment in dose based on (a) a measurement obtained from said evaluating of first wafer, (b) calibration data for the dose-sensitive method, and (c) a dose used by an ion implanter in implanting the first wafer;    evaluating a second wafer using another method that is sensitive to both dose and energy, wherein the second wafer is implanted by said ion implanter after said adjustment in dose is made; and    determining an adjustment in energy for said ion implanter based at least on another measurement obtained from said evaluating of second wafer.    
   
   
       16 . A system for matching a plurality of ion implanters to one another, the system comprising: 
 a first implant metrology tool sensitive to dose of implants in a first wafer;    a computer, coupled to the first implant metrology tool, the computer being programmed to determine a dose adjustment, based at least on (a) a first measurement of dose from the first implant metrology tool and (b) a predetermined value of dose in an ion implanter used to implant the first wafer;    a second implant metrology tool sensitive to dose and energy of implants;    wherein the computer is further coupled to the second implant metrology tool, and the computer is further programmed to determine another adjustment to said ion implanter, based at least on (a) a second measurement obtained from evaluation of a second wafer by the second implant metrology tool and (b) a predetermined value of energy used in said ion implanter to implant the second wafer after said dose adjustment.