Adhesive resin with high damping properties and method of manufacture thereof

Abstract

A composite material, comprising a meta layer and an adhesive resin composition comprising, based on the total weight of the composition, a first resin component having one or more glass transition temperatures of about −15 to about 50° C.; about 5 about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C.; and up to about 50 weight percent of a particulate inorganic filler; wherein a tan δ value of the adhesive resin composition is greater than about 0.2 over a temperature range of about −15 to about 50° C. when measured at a frequency of 1 Hz. The composites are of particular utility in suspension assemblies.

1 . A composite comprising: 
 an adhesive resin layer comprising: 
 a first resin component having one or more glass transition temperatures of about −15 to about 50° C.;  
 about 5 to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C., based on the total weight of the adhesive resin layer; and  
 up to 50 weight percent of a particulate inorganic filler based on the total weight of the adhesive resin layer; wherein a tan δ value of the adhesive resin layer is greater than about 0.2 over a temperature range of about −15 to about 50° C. when measured at a frequency of 1 Hz; and  
   a metal layer disposed on the adhesive resin layer.    
   
   
       2 . The composite of  claim 1 , wherein the first resin component comprises a combination of resins, each having a glass transition temperature of about −15 to about 50° C.  
   
   
       3 . The composite of  claim 2 , wherein the combination of resins includes a first resin having a glass transition temperature of about −5° C. to about 0° C. at a frequency of about 1 Hz, and a second resin having a glass transition temperature of about 20° C. to about 50° C. at a frequency of about 1 Hz.  
   
   
       4 . The composite of  claim 1 , wherein the first resin component comprises latex acrylic resin, solvent based acrylic resin, solvent based acrylic elastomer, natural rubber, synthetic rubber, or a combination comprising at least one of the foregoing.  
   
   
       5 . The composite of  claim 2 , wherein the first resin component comprises an acrylic copolymer comprising a plurality of repeating units having a general formula:  
     
       
         
         
             
             
         
       
     
     wherein R 1  and R 4  are independently an alkyl group with 1 to 20 carbons, hydrogen, or an alkyl with up to 6 carbons with hydroxy functionality; R 2  and R 3  are independently an alkyl group with 1 to 20 carbons or hydrogen; and W and L are greater than or equal to 1.  
   
   
       6 . The composite of  claim 1 , wherein the second resin component has one or more glass transition temperatures greater than about 150° C.  
   
   
       7 . The composite of  claim 1 , wherein the second resin component is present in an amount of about 10 to about 25 weight percent, based on the total weight of the adhesive resin layer.  
   
   
       8 . The composite of  claim 1 , wherein the second resin component comprises phenolic resin, acrylic resin, polyphenylene ether resin, or a combination comprising at least one of the forgoing resins.  
   
   
       9 . The composite of  claim 8 , wherein the phenolic resin comprises a plurality of structural units having the formula  
     
       
         
         
             
             
         
       
     
     wherein for each structural unit, Y is independently a hydrogen, halogen, primary or secondary lower alkyl, alkoxy, phenyl, haloalkyl, aminoalkyl, hydrocarbonoxy, halohydrocarbonoxy, aryl, allyl, phenylalkyl, or hydroxy substituted alkyl comprising up to 6 carbons, such as methylol, and X is a hydroxy.  
   
   
       10 . The composite of  claim 8 , wherein the phenolic resin comprises a molecular weight of about 300 to about 1,000.  
   
   
       11 . The composite of  claim 1 , wherein the adhesive resin layer has a storage modulus that changes by about 2 to about 3 orders of magnitude on a log scale over a temperature range of about −10° C. to about 70° C.  
   
   
       12 . The composite of  claim 1 , wherein the inorganic filler comprises silica, alumina, titania, zirconia, glass, or a combination comprising at least one of the foregoing fillers.  
   
   
       13 . The composite of  claim 11 , wherein the adhesive resin layer comprises less than about 1 weight percent of the inorganic filler based on the total weight of the adhesive resin layer.  
   
   
       14 . The composite of  claim 1 , wherein the metal layer comprises stainless steel, copper, aluminum, zinc, iron, transition metals, alloys comprising at least one of the foregoing metals, or stainless steel.  
   
   
       15 . The composite of  claim 1 , further comprising a second metal layer disposed on a side of the adhesive resin layer opposite to the metal layer.  
   
   
       16 . The composite of  claim 15 , wherein the composite is disposed between a mount plate and a circuit element.  
   
   
       17 . The composite of  claim 16 , wherein the composite, mount plate, and circuit element provide a portion of a suspension assembly.  
   
   
       18 . A compsite, comprising 
 an adhesive resin composition comprising, based on the total weight of the composition: 
 about 5 to about 95 weight percent of a first resin component comprising a first resin having a first glass transition temperature of about −15° C. to about 10° C., and a second resin having a second glass transition temperature of about 10° C. to about 50° C., wherein the first glass transition temperature is different from the second glass transition temperature;  
 about 5 to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C., wherein the second resin component comprises phenolic resin, acrylic resin, polyphenylene ether resin, or a combination comprising at least one of the forgoing resins; and  
 up to about 50 weight percent of a particulate inorganic filler; wherein a tan δ value of the adhesive resin composition is greater than about 0.2 over a temperature range of about −15° C. to about 50° C. when measured at a frequency of 1 Hz; and  
   a metal layer disposed on the adhesive resin layer.    
   
   
       19 . The composite of  claim 18 , further comprising a second metal layer disposed on a side of the adhesive resin layer opposite to the metal layer, wherein the composite is disposed between a mount plate and a circuit element.  
   
   
       20 . The composite of  claim 19 , wherein the composite, mount plate, and circuit element provide a portion of a suspension assembly.