Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe

Abstract

An electronic component or assembly that is assembled within a case that is designed to operate as a liquid phase to gas phase heat pipe where said electronic component or assembly is introduced into a liquid or partially liquid partially gaseous environment; whereby said liquid evaporates into a gas absorbing heat energy and transferring it to and through the component's or assembly's case. The case will be engineered out of materials that do not contaminate the liquid and electronics with ions and will be engineered to operate in any physical orientation.

1 . An enclosure that contains an electronic assembly and a liquid that is designed to operate as a heat pipe for cooling electronics contained within.  
   
   
       2 .  Claim 1  where said enclosure contains some portion of liquid and some portion of gas such that said enclosure operates as a liquid phase to a vapor phase heat pipe where said liquid evaporates into a gas vapor into a gas vapor transfers heat and condenses back into a liquid.  
   
   
       3 .  Claim 2  where said enclosure maintains some potion of said liquid in contact with said electronic assembly despite the physical orientation of said electronic assembly.  
   
   
       4 .  Claim 3  where said enclosure includes a plurality of chambers where said gas vapor can move, where said chambers are designed to maximize the surface area of said enclosure such that thermal energy is moved from said gas vapor through said enclosure more efficiently.  
   
   
       5 .  Claim 4  where said chambers are comprised of cylinders that form cooling towers and said enclosure is comprise of a material that does not freely emit ions.  
   
   
       6 .  Claim 3  where said electronic assembly consists of at least one integrated circuit.  
   
   
       7 .  Claim 6  where said integrated circuits are wire bonded.  
   
   
       8 .  Claim 6  where said integrated circuits are soldered.  
   
   
       9 .  Claim 6  where said integrated circuits are attached by conductive epoxy.  
   
   
       10 .  Claim 6  where said integrated circuits are attached by other means.  
   
   
       11 .  Claim 6  where said integrated circuits form an electronic sub-assembly.  
   
   
       12 .  Claim 3  where said electronic assembly and case are contained within the form factor of an electronic device that is packaged by means that do not use said liquid phase to gas vapor phase heat pipe.  
   
   
       13 .  Claim 4  where said electronic assembly and case are contained within the form factor of an electronic device that is packaged by means that do not use said liquid phase to gas vapor phase heat pipe.  
   
   
       14 .  Claim 5  where said electronic assembly and case are contained within the form factor of an electronic device that is packaged by means that do not use said liquid phase to gas vapor phase heat pipe.