Conductive pattern and method of making

Abstract

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

1 . A method of making a conductive pattern, the method comprising: 
 placing a pre-formed solid mask dielectric layer, with pre-formed openings therethrough, on a conductive substrate;    plating the conductive pattern atop the conductive substrate, through the openings; and    separating the conductive pattern from the conductive substrate.    
   
   
       2 . The method of  claim 1 , wherein the dielectric layer is made from a polymer material.  
   
   
       3 . The method of  claim 1 , wherein the placing the dielectric layer includes attaching the dielectric layer to the conductive substrate.  
   
   
       4 . The method of  claim 1 , wherein the plating includes plating directly onto the conductive substrate.  
   
   
       5 . The method of  claim 1 , further comprising, prior to the plating, roughening at least part of the conductive substrate.  
   
   
       6 . The method of  claim 1 , 
 further comprising, prior to,the plating, depositing a conductive ink layer onto the conductive substrate, through the openings;    wherein the plating includes plating onto the conductive ink layer.    
   
   
       7 . The method of  claim 1 , wherein the separating includes: 
 depositing an adhesive layer on the conductive pattern; and    using the adhesive layer to adhesively separate the conductive pattern from the conductive substrate.    
   
   
       8 . A method of making a conductive pattern, the method comprising: 
 printing a patterned dielectric layer on a conductive substrate, wherein the patterned dielectric layer has openings therethrough;    plating the conductive pattern atop the conductive substrate, through the openings; and    separating the conductive pattern from the conductive substrate.    
   
   
       9 . The method of  claim 8 , wherein the printing includes printing a curable material.  
   
   
       10 . The method of  claim 9 , further comprising curing the curable material of the dielectric layer prior to the plating.  
   
   
       11 . The method of  claim 8 , wherein the plating includes plating directly onto the conductive substrate.  
   
   
       12 . The method of  claim 8 , further comprising, prior to the plating, roughening at least part of the conductive substrate.  
   
   
       13 . The method of  claim 8 , 
 further comprising, prior to the plating, depositing a conductive ink layer onto the conductive substrate, through the openings;    wherein the plating includes plating onto the conductive ink layer.    
   
   
       14 . The method of  claim 8 , wherein the separating includes: 
 depositing an adhesive layer on the conductive pattern; and    using the adhesive layer to adhesively separate the conductive pattern from the conductive substrate.    
   
   
       15 . The method of  claim 8 , wherein the printing includes printing directly onto the conductive substrate.  
   
   
       16 . A method of making a conductive pattern, the method comprising: 
 placing a dielectric layer on a conductive substrate, wherein the dielectric layer has openings therethrough;    plating the conductive pattern atop the conductive substrate, through the openings; and    separating the conductive pattern from the conductive substrate;    wherein the separating includes: 
 depositing an adhesive layer on the conductive pattern; and  
 using the adhesive layer to adhesively separate the conductive pattern from the conductive substrate.  
   
   
   
       17 . The method of  claim 16 , wherein the placing the dielectric layer includes attaching the dielectric layer to the conductive substrate.  
   
   
       18 . The method of  claim 16 , wherein the plating includes plating directly onto the conductive substrate.  
   
   
       19 . The method of  claim 16 , further comprising, prior to the plating, roughening at least part of the conductive substrate.  
   
   
       20 . The method of  claim 16 , 
 further comprising, prior to the plating, depositing a conductive ink layer onto the conductive substrate, through the openings;    wherein the plating includes plating onto the conductive ink layer.