Sacrificial component

Abstract

A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.

1 . A method comprising: 
 electrically connecting at least one discrete component to a land side of a substrate;    forming solder balls on the land side of a substrate; and    attaching at least one non operational, sacrificial component to the land side of the substrate.    
   
   
       2 . The method of  claim 1  wherein attaching the at least one non operational sacrificial component to the land side of the substrate includes placing the non operational, sacrificial component so as to prevent the discrete component electrically connected to the land side of the substrate from contacting another surface.  
   
   
       3 . The method of  claim 1  further comprising providing a fuse within the non operational, sacrificial component.  
   
   
       4 . The method of  claim 1  wherein attaching the at least one non operational sacrificial component to the land side of the substrate includes selecting a non operational, sacrificial component having a height dimension that is less than the height of the solder balls.  
   
   
       5 . The method of  claim 1  wherein attaching the at least one non operational sacrificial component to the land side of the substrate includes selecting a non operational, sacrificial component having a height dimension that is between the height of the solder balls and the height of the at least one discrete component.  
   
   
       6 . A method comprising: 
 placing a plurality of lands on a first major surface of a substrate;    electrically coupling at least one component to at least some of the plurality of lands on the first major surface, the at least one component having a first height with respect to the first major surface; and    coupling at least one sacrificial component attached to the first major surface, the at least one sacrificial component having a second height with respect to the first major surface, the second height greater than the first height.    
   
   
       7 . The method of  claim 6  further comprising selecting the at least one sacrificial component that includes a fuse.  
   
   
       8 . The method of  claim 6  further comprising selecting the at least one sacrificial component that is substantially nonconductive.  
   
   
       9 . The method of  claim 6  wherein the at least one electrical component includes a component having circuitry therein.  
   
   
       10 . The method of  claim 6  wherein the substrate is at least partially flexible, the sacrificial component preventing the contact of the at least one electrical component with another surface.  
   
   
       11 . A method comprising: 
 placing a plurality of solder bumps on a first major surface of a substrate;    placing a plurality of lands on the first major surface of the substrate;    electrically coupling at least one component to at least some of the plurality of lands on the first major surface, the at least one component having a first height with respect to the first major surface; and    providing a stop attached to the first major surface, the block having a second height with respect to the first major surface, the second height greater than the first height.    
   
   
       12 . The method of  claim 11  wherein the block is attached to at least one of the plurality of lands on the first major surface of the substrate.  
   
   
       13 . The method of  claim 11  wherein the block is attached to at least two of the plurality of lands on the first major surface of the substrate.  
   
   
       14 . The method of  claim 11  wherein the block is formed from a substantially insulative material.  
   
   
       15 . The method of  claim 11  wherein the block includes a fuse.