Heat sink

Abstract

A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element includes a heat conductive plate and a heat conductive block installed at the center thereof. The area of the bottom surface of the heat conductive block is greater than that of the topmost surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

1 . A heat sink comprising: 
 a heat dissipating base, which has a heat conductive plate and a heat conductive block, the heat conductive plate and the heat conductive block being separately formed, the heat conductive block having a flat top side and a flat bottom side, the flat bottom side of the heat conductive block being disposed at the top side of the heat conductive plate; and    a plurality of heat dissipating fins, installed perpendicular to the heat conductive plate and the flat top side of the heat conductive block, the heat dissipating fins being disposed on and directly connected to the heat conductive plate and the flat top side of the heat conductive block;    wherein the flat bottom side of the heat conductive block has a larger area than the flat top side of the heat conductive block.    
   
   
       2 . The heat sink of  claim 1 , wherein the plurality of fins on the heat conductive block is installed on a side surface of the heat conductive block.  
   
   
       3 . The heat sink of  claim 1 , wherein the plurality of fins, the heat conductive plate, and the heat conductive block are made by aluminum, aluminum alloys, copper, and copper alloys or a material with high coefficient of thermal conduction.  
   
   
       4 . The heat sink of  claim 1 , wherein the plurality of fins are connected to the heat dissipating base by soldering, or formed together with the heat dissipating base.  
   
   
       5 . The heat sink of  claim 1 , wherein the height of the heat conductive block is not greater than the height of the fins on the heat dissipating base.  
   
   
       6 . The heat sink of  claim 1 , wherein a side surface of the heat conductive block is a smooth curved surface, or a plane surface.  
   
   
       7 . A heat sink, comprising: 
 a heat dissipating base, which has a heat conductive plate and a heat conductive block, the heat conductive plate and the heat conductive block being separately formed, the heat conductive block having a top side and a bottom side, the bottom side of the heat conductive block being disposed on a top side of the heat conductive plate; and    a plurality of heat dissipating fins disposed on and directly connected to the top side of the heat conductive plate and the top side of the heat conductive block;    wherein the bottom side of the heat conductive block has a larger area than the top side of the heat conductive block.    
   
   
       8 . A heat dissipating device, comprising: 
 a fan; and    a heat sink coupled to the fan, wherein the heat sink comprises: 
 a heat dissipating base, which has a heat conductive plate and a heat conductive block, the heat conductive block having a top side and a bottom side, the bottom side of the heat conductive block being disposed on a top side of the heat conductive plate; and  
 a plurality of heat dissipating fins disposed on the top side of the heat conductive plate;  
 wherein the bottom side of the heat conductive block has a larger area than the top side of the heat conductive block.  
   
   
   
       9 . The heat dissipating device of  claim 8 , wherein the heat dissipating base further has a heat dissipating shell covering over the heat conductive plate and the heat conductive block, and the heat dissipating fins are installed to the heat dissipating shell.  
   
   
       10 . The heat dissipating device of  claim 9 , wherein the heat dissipating shell and the heat conductive block are made of different metal materials.  
   
   
       11 . The heat dissipating device of  claim 10 , wherein the heat dissipating shell is made of aluminum, and the heat conductive block is made of copper.  
   
   
       12 . The heat dissipating device of  claim 9 , wherein the heat dissipating shell and the heat conductive block are made by aluminum, aluminum alloys, copper, and copper alloys or a material with high coefficient of thermal conduction.  
   
   
       13 . The heat dissipating device of  claim 9 , wherein the heat conductive block is covered by the heat dissipating shell by soldering or high-pressure mounting.  
   
   
       14 . The heat dissipating device of  claim 9 , wherein the sink has a screw for connecting the heat dissipating shell and the heat conductive block.  
   
   
       15 . The heat dissipating device of  claim 9 , wherein the heat dissipating fins are formed together with the dissipating shell.  
   
   
       16 . The heat dissipating device of  claim 9 , wherein the heat dissipating fins are only formed on a topmost surface and a side surface of the dissipating shell.  
   
   
       17 . The heat dissipating device of  claim 8 , wherein the heat sink is used for dissipating a heat-producing device and a bottom surface of the heat conductive plate is in direct contact with the heat-producing device.  
   
   
       18 . The heat dissipating device of  claim 8 , wherein the fan is fixed onto the heat sink using a plurality of fixing elements on the fins at corners of the heat sink.  
   
   
       19 . The heat dissipating device of  claim 8 , wherein a cross section width of a bottom surface of the conductive block is smaller than a cross section width of the heat conductive plate.  
   
   
       20 . The heat dissipating device of  claim 8 , wherein a vertical height of the heat dissipating base is smaller than or equal to a vertical height from a lower surface of the heat dissipating base to a top of the fins.  
   
   
       21 . The heat dissipating device of  claim 8 , wherein an angle between the bottom side and a side surface of the conductive block is small than 90 degrees.