US2007006996A1PendingUtilityA1

Cooler for electronic equipment

Assignee: MIKUBO KAZUYUKIPriority: Jun 27, 2003Filed: Jun 25, 2004Published: Jan 11, 2007
Est. expiryJun 27, 2023(expired)· nominal 20-yr term from priority
G06F 1/203G06F 2200/201
43
PatentIndex Score
0
Cited by
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References
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Claims

Abstract

[Object] A cooling device for a thin electronic equipment having a larger heat radiation area and preventing leakage of refrigerant. [Means for Solving Problems] A cooling device includes first and second cooling panels ( 1, 2 ) wherein a passage ( 11, 21 ) is formed by bonding together a top heat radiation panel and a bottom heat radiation panel each having a groove therein, and a circulation pump ( 3 ) for circulating refrigerant within the passage ( 11, 21 ). In the top heat radiation panel of the second cooling panel ( 2 ) are formed an outlet port through which the refrigerant flows out from the passage ( 21 ) to the circulation pump ( 3 ) and an inlet port through which the refrigerant flows in from the circulation pump ( 3 ) to the passage ( 21 ). The circulation pump ( 3 ) is fixed onto the top heat radiation plate of the cooling panel ( 2 ) so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

Claims

exact text as granted — not AI-modified
1 . A cooling device for an electronic equipment, comprising: 
 a first cooling panel wherein a first passage through which refrigerant circulates is formed;    a second cooling panel wherein a second passage through which said refrigerant circulates is formed, said formed, said second cooling panel being disposed to oppose said first cooling panel; and    a circulation pump for circulating said refrigerant through said first passage and said second passage to thereby diffuse heat transferred to said first cooling panel and said second cooling panel, wherein:    said first cooling panel and said second cooling panel sandwich therebetween an electronic circuit substrate.    
   
   
       2 . The cooling device for an electronic equipment according to  claim 1 , further comprising a coupling member bearing said first cooling panel and said second cooling panel for opening and closing with respect to each other, and said connecting member has a flexibility.  
   
   
       3 . The cooling device for an electronic equipment according to  claim 1 , wherein at least one of said first cooling panel and said second cooling panel includes a micro-channel structure within said passage, said micro-channel structure including a plurality of narrow passages having a width smaller than a width of said passage.  
   
   
       4 . The cooling device for an electronic equipment according to  claim 1 , wherein said at least one of said first cooling panel and said second cooling panel includes an area in which an air-cooled fin is formed on a surface thereof, said area being disposed downstream of said micro-channel structure.  
   
   
       5 . The cooling device for an electronic equipment according to  claim 4 , wherein said passage in said area is wobbled.  
   
   
       6 . The cooling device for an electronic equipment according to  claim 4 , wherein a cooling fan is disposed corresponding to said air-cooled fin.  
   
   
       7 . The cooling device for an electronic equipment according to  claim 1 , wherein said circulation pump is fixed onto a surface of said second cooling panel.  
   
   
       8 . The cooling device for an electronic equipment according to  claim 1 , wherein a reservoir communicated with said second passage is disposed on a surface of said second cooling panel.  
   
   
       9 . The cooling device for an electronic equipment according to  claim 1 , wherein a reservoir communicated with said second passage is formed within said second cooling panel.  
   
   
       10 . The cooling device for an electronic equipment according to  claim 1 , wherein at least one of said first cooling panel and said second cooling panel is formed by bonding together a top heat radiation panel and a bottom heat radiation panel, in at least one of which is formed a groove.  
   
   
       11 . The cooling device for an electronic equipment according to  claim 1 , wherein said first cooling panel has an area smaller than an area of said second cooling panel.  
   
   
       12 . The cooling device for an electronic equipment according to  claim 1 , wherein said first passage has a width smaller than a width of said passage.  
   
   
       13 . The cooling device for an electronic equipment according to  claim 1 , wherein said first passage has a depth larger than a depth of said second passage.  
   
   
       14 . An electronic equipment mounting thereon the cooling device for electronic equipment according to  claim 1.

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