US2007007558A1PendingUtilityA1

Light emitting diode package and method for making same

48
Individually held — no corporate assignee on recordPriority: Jun 27, 2005Filed: Jun 27, 2006Published: Jan 11, 2007
Est. expiryJun 27, 2025(expired)· nominal 20-yr term from priority
Inventors:Joseph Mazzochette
H10W 90/754H10W 90/753H10W 90/00H10H 20/8506H10H 20/8581H05K 2201/09181Y10T29/49155H05K 2201/09127H05K 3/0061H05K 2201/09845H05K 1/141H05K 1/182H05K 2203/063H05K 3/3442Y10T29/49139Y10T29/49126H05K 2201/10106Y10T156/13Y02P70/50H05K 1/021H05K 3/403
48
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Claims

Abstract

A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. Optionally, the LED die may be mounted directly on a base metal layer. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. The LED package is advantageously laminated together using a pre-punched pre-preg material or a pressure sensitive adhesive.

Claims

exact text as granted — not AI-modified
1 . A light emitting diode (LED) assembly comprising: 
 a printed wire board (PWB) comprising one or more apertures;    one or more heat sink studs secured within the one or more apertures; and    one or more LED die mounted on the one or more heat sink studs, wherein the one or more heat sink studs are composed of a material having a thermal coefficient of expansion (TCE) approximately equal to the TCE of the one or more LED die.    
     
     
         2 . The LED assembly of  claim 1 , further comprising one or more reflectors disposed on the PWB, wherein the one or more reflectors form one or more cavities around the one or more LED die.  
     
     
         3 . The LED assembly of  claim 2 , wherein the one or more LED die are at least partially encapsulated within the cavity.  
     
     
         4 . The LED assembly of  claim 1 , further comprising one or more conductors disposed on the PWB, wherein the one or more LED die are electrically connected to the conductors.  
     
     
         5 . The LED package of  claim 1 , wherein the PWB comprises one or more castellations for mounting the LED package to a second PWB.  
     
     
         6 . The LED package of  claim 1 , wherein the one or more heat sink studs are knurled for fitting in the one or more apertures.  
     
     
         7 . The LED package of  claim 1 , wherein the one or more apertures are plated with a solder material which joins the one or more heat sink studs therein.  
     
     
         8 . The LED package of  claim 1 , wherein the one or more heat sink studs are peened for fitting in the one or more apertures.  
     
     
         9 . A LED package comprising: 
 a PWB comprising one or more apertures;    a metal heat sink layer at least partially overlying the PWB, wherein one or more portions of the metal heat sink layer comprise concavities formed in registration with the one or more apertures; and    one or more LED mounted on the one or more concavity portions.    
     
     
         10 . The LED package of  claim 9 , wherein the one or more concavity portions comprise a reflective material.  
     
     
         11 . A LED package comprising: 
 a PWB comprising one or more apertures;    a metal heat sink layer at least partially underlying the PWB, wherein one or more portions of the metal heat sink layer comprise concavities formed in registration with the one or more apertures; and    one or more LED die mounted on the one or more concavity portions.    
     
     
         12 . The LED package of  claim 11 , wherein the concavity portions of the metal heat sink layer are thermally coupled to an external heat sink.  
     
     
         13 . A LED package comprising: 
 a heat sink;    one or more heat sink studs at least partially embedded in the heat sink;    a PWB overlying the heat sink, wherein the PWB comprises one or more apertures in registration with the one or more heat sink studs; and    one or more LED die mounted on the one or more heat sink studs.    
     
     
         14 . The LED package of  claim 13 , further comprising one or more reflectors disposed on the PWB, wherein the one or more reflectors form one or more cavities at least partially surrounding the one or more LED die.  
     
     
         15 . The LED package of  claim 14 , wherein the one or more LED die are at least partially encapsulated within the one or more cavities.  
     
     
         16 . The LED package of  claim 13 , further comprising one or more conductors disposed on the PWB, wherein the one or more LED die are electrically connected to the conductors.  
     
     
         17 . The LED package of  claim 13 , wherein the PWB comprises a fiberglass reinforced laminate material.  
     
     
         18 . The LED package of  claim 13 , wherein the PWB comprises a high temperature fiberglass reinforced laminate material.  
     
     
         19 . The LED package of  claim 13 , wherein the one or more heat sink studs are composed of a material having a TCE approximately equal to the TCE of the one or more LED die.  
     
     
         20 . A LED package comprising: 
 a metal layer;    a PWB assembly comprising two or more dielectric layers, the assembly comprising one or more stepped apertures, wherein the PWB overlies the metal layer;    one or more isolators disposed in the one or more stepped apertures of the PWB assembly and mounted on the metal layer; and    one or more LED die mounted on the one or more isolators.    
     
     
         21 . The LED package of  claim 20 , wherein the one or more isolators are composed of a material having a TCE approximately equal to the TCE of the one or more LED die.  
     
     
         22 . The LED package of  claim 20 , further comprising an optical element disposed over the one or more LED die.  
     
     
         23 . A LED package comprising: 
 a metal layer;    a PWB assembly comprising two or more dielectric layers, the assembly comprising one or more stepped apertures, wherein the PWB overlies the metal layer; and    one or more LED die mounted on the metal layer, wherein the metal layer is composed of a material having a TCE approximately equal to the TCE of the one or more LED die.    
     
     
         24 . A method of fabricating a multi-layer PWB assembly, comprising the steps of: 
 providing a plurality of PWB layers, wherein each PWB layer includes at least one metal layer and at least one dielectric layer;    patterning the at least one metal layer of the plurality of PWB layer;    forming apertures in each PWB layer, the apertures being aligned and sized to form one or more stepped cavities when the PWB layers are laminated together into a multi-layer assembly; and    laminating the plurality of PWB layers together to form a multi-layer PWB assembly having one or more stepped cavities.    
     
     
         25 . The method of  claim 24 , wherein the laminating step comprises disposing a laminate layer in between the PWB layers.  
     
     
         26 . The method of  claim 25 , wherein the laminate layer comprises a pre-punched pre-preg material.  
     
     
         27 . The method of  claim 26 , further comprising the step of providing one or more plated vias through the multi-layer PWB assembly.  
     
     
         28 . The method of  claim 25 , wherein the laminate layer comprises a pressure sensitive adhesive.  
     
     
         29 . The method of  claim 24 , further comprising the step of providing one or more vias through the multi-layer PWB assembly.  
     
     
         30 . The method of  claim 29 , further comprising the step of plating the one or more vias.  
     
     
         31 . A PWB assembly fabricated according to the method of  claim 24 .  
     
     
         32 . A PWB assembly fabricated according to the method of  claim 27 .  
     
     
         33 . A method of fabricating a LED package comprising the steps of: 
 disposing a multi-layer PWB assembly including a stepped cavity on an insulating layer, the insulating layer having an aperture in registration with the stepped cavity;    laminating the multi-layer PWB assembly, the insulating layer, and a metal base together; and    disposing one or more LED die in the stepped cavity.    
     
     
         34 . The method of  claim 33 , wherein the one or more LED die are disposed on the metal base.  
     
     
         35 . The method of  claim 33 , wherein the one or more LED die are mounted on an isolator disposed on the metal base.  
     
     
         36 . The method of  claim 35 , wherein the isolator is composed of a material having a TCE approximately equal to the TCE of the one or more LED die.  
     
     
         37 . The method of  claim 33 , wherein the insulating layer comprises a dielectric material.  
     
     
         38 . The method of  claim 33 , wherein the insulating layer comprises a high temperature fiberglass reinforced material.  
     
     
         39 . The method of  claim 33 , wherein the insulating layer comprises one or more layers of laminate material.  
     
     
         40 . The method of  claim 39 , wherein the one or more layers of laminate material comprise pre-punched pre-preg material.  
     
     
         41 . The method of  claim 39 , wherein the one or more layers of laminate material comprise pressure sensitive adhesive.  
     
     
         42 . The method of  claim 33 , further comprising the step of disposing an encapsulant over at least a portion of the one or more LED die.  
     
     
         43 . The method of  claim 33 , further comprising the step of attaching a reflector to the multi-layer PWB assembly.  
     
     
         44 . The method of  claim 33 , further comprising the step of disposing one or more dams between the one or more layers of laminate material and the stepped cavity to prevent the laminate material from entering the stepped cavity during the lamination step.  
     
     
         45 . A LED package fabricated according to the method of  claim 33 .  
     
     
         46 . The LED package of  claim 45 , wherein the insulating layer comprises pre-punched pre-preg material.  
     
     
         47 . The LED package of  claim 45 , further comprising one or more dams between the one or more layers of laminate material and the stepped cavity to prevent the laminate material from entering the stepped cavity.  
     
     
         48 . A LED package comprising: 
 a multi-layer PWB assembly including a stepped cavity, an insulating layer, and a metal base laminated together by a laminate material; and    one or more LED die disposed in the stepped cavity.    
     
     
         49 . The LED package of  claim 48 , wherein the PWB assembly comprises one or more vias.  
     
     
         50 . The LED package of  claim 49 , wherein the one or more vias are electrically insulated from the metal base by the insulating layer.  
     
     
         51 . The LED package of  claim 48 , wherein the laminate material comprises a pressure sensitive adhesive.  
     
     
         52 . The LED package of  claim 48 , wherein the laminate material comprises a pre-preg material.  
     
     
         53 . The LED package of  claim 52 , wherein the pre-preg material includes an aperture in registration with the stepped cavity.  
     
     
         54 . The LED package of  claim 48 , wherein the one or more LED die are disposed on the metal base.  
     
     
         55 . The LED package of  claim 54 , wherein the metal base is composed of a material having a TCE approximately equal to the TCE of the one or more LED die.  
     
     
         56 . The LED package of  claim 48  wherein the one or more LED die are mounted on an isolator disposed on the metal base.  
     
     
         57 . The LED package of  claim 56 , wherein the isolator is composed of a material having a TCE approximately equal to the TCE of the one or more LED die.  
     
     
         58 . The LED package of  claim 48 , wherein the insulating layer comprises a fiberglass reinforced material.  
     
     
         59 . The LED package of  claim 48 , wherein the insulating layer comprises one or more layers of laminate material.  
     
     
         60 . The LED package of  claim 59 , wherein the one or more layers of laminate material comprise pre-punched pre-preg material.  
     
     
         61 . The LED package of  claim 60 , wherein the one or more layers of laminate material comprise pressure sensitive adhesive.

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