Lamination and delamination technique for thin film processing

Abstract

This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer whose thermal decomposition temperature changes drastically upon photoexposure. These materials, prior to photoexposure, can withstand temperatures in the range of approximately 200° C. to 300° C. without decomposition, yet decompose at around 100° C. with photoexposure. The releasable adhesion layer can be used in a thermal transfer element, sandwiching a donor substrate and a transfer layer having a plurality of multicomponent transfer units. In the absence of light, the releasable adhesion layer can sustain high temperature processing of these multicomponent transfer units. By photoexposing according to a pattern, the photoexposed multicomponent transfer units can be selectively released at a low temperature to transfer to a receptor.

1 . A device disposed on a receptor substrate, formed by transferring a multicomponent transfer unit from a thermal transfer element to the receptor substrate, using releasable adhesion layers that do not contamination the transferred device since they decompose completely and leave no detectable residue.  
     
     
         2 . A device as in  claim 1  wherein the releasable adhesion layer comprising a polymer composition 
 having a low delamination temperature in the presence of light, whereby allowing the delamination of the adhesion layer to transfer the selected multicomponent units by exposing the selected multicomponent units to light; and    maintaining good adhesion between the donor substrate and the transfer layer at a temperature higher than the delamination temperature in the absence of light, whereby permitting processing the multicomponent transfer units at a temperature higher than the delamination temperature.    
     
     
         3 . A device as in  claim 1  wherein the thermal transfer element comprises a donor substrate and a transfer layer with a releasable adhesion layer disposed between the donor substrate and the transfer layer.  
     
     
         4 . A device as in  claim 1 , wherein the device is an organic electroluminescent device, an organic transistor, or an organic laser.  
     
     
         5 . A device as in  claim 1 , wherein the device comprises a component in electronic circuitry, an electronic device, a thin film transistor device, a memory device, or a display device.  
     
     
         6 . A device as in  claim 1 , wherein the device is in electrical contact with other existing devices on the receptor.  
     
     
         7 . A device as in  claim 1 , wherein the receptor receiving surface comprises a releasable adhesion layer to form a thermal transfer element.  
     
     
         8 . A circuit comprising a plurality of thin film transistor devices disposed on a receptor substrate, at least one of the thin film transistor device formed by transferring a multicomponent transfer unit from a thermal transfer element to the receptor substrate using releasable adhesion layers that do not contamination the transferred device since they decompose completely and leave no detectable residue.  
     
     
         9 . A circuit as in  claim 8  wherein the releasable adhesion layer comprising a polymer composition 
 having a low delamination temperature in the presence of light, whereby allowing the delamination of the adhesion layer to transfer the selected multicomponent units by exposing the selected multicomponent units to light; and    maintaining good adhesion between the donor substrate and the transfer layer at a temperature higher than the delamination temperature in the absence of light, whereby permitting processing the multicomponent transfer units at a temperature higher than the delamination temperature.    
     
     
         10 . A circuit as in  claim 8  wherein the thermal transfer element comprises a donor substrate and a transfer layer with a releasable adhesion layer disposed between the donor substrate and the transfer layer.  
     
     
         11 . A circuit as in  claim 8 , wherein the circuit comprises a memory device or a portion of a memory device, or a logic device or a portion of a logic device.  
     
     
         12 . A circuit as in  claim 8 , wherein the receptor substrate comprises a memory device or a portion of a memory device, or a logic device or a portion of a logic device.  
     
     
         13 . A circuit as in  claim 8 , wherein the circuit and the receptor each comprises a portion of a memory or logic device, and together form a complete memory or logic device.  
     
     
         14 . A circuit as in  claim 8 , wherein the circuit comprises a plurality of first electrodes of a cross bar memory device and the receptor comprises a plurality of second electrodes of a cross bar memory device, and together form a complete cross bar memory device.  
     
     
         15 . A display comprising a plurality of components disposed on a receptor substrate, at least one of the components formed by transferring a multicomponent transfer unit from a thermal transfer element to the receptor substrate using releasable adhesion layers that do not contamination the transferred device since they decompose completely and leave no detectable residue.  
     
     
         16 . A display as in  claim 15  wherein the releasable adhesion layer comprising a polymer composition 
 having a low delamination temperature in the presence of light, whereby allowing the delamination of the adhesion layer to transfer the selected multicomponent units by exposing the selected multicomponent units to light; and    maintaining good adhesion between the donor substrate and the transfer layer at a temperature higher than the delamination temperature in the absence of light, whereby permitting processing the multicomponent transfer units at a temperature higher than the delamination temperature.    
     
     
         17 . A display as in  claim 15  wherein the thermal transfer element comprises a donor substrate and a transfer layer with a releasable adhesion layer disposed between the donor substrate and the transfer layer.  
     
     
         18 . A display as in  claim 15 , wherein the components of the display comprises a memory or logic device or a portion of a memory or logic device.  
     
     
         19 . A display as in  claim 15 , wherein the receptor substrate comprises a memory or logic device or a portion of a memory or logic device.  
     
     
         20 . A display as in  claim 15 , wherein the components of the display and the receptor each comprises a portion of a memory or logic device, and together form a complete memory or logic device.