Carrier employing snap-fitted membrane retainer

Abstract

Disclosed herein is an improved carrier design for use in a chemical mechanical polishing process. The carrier employs a retainer ring that is fastened to the side of carrier, as opposed to the front of the carrier, which alleviates undesired uneven wear of the retainer ring surface. Specifically exemplified herein is a carrier comprising a membrane that is secured to the carrier body by a retainer ring that is snap-fitted to the carrier body.

1 . A carrier for use with an integrated circuit wafer comprising: 
 a carrier body comprising a front surface, a back surface and a side surface;    a retainer ring comprising a first portion sized and configured for positioning on a portion of said front surface and having a second portion attached to or integrated with said first portion, said second portion comprising an inner surface sized and configured for positioning on all or a portion of said side surface;    a snap fit mechanism defined on said inner surface and said side surface for securing said retainer ring to said carrier body; and    a membrane covering a portion of said front surface and secured to said carrier body by said retainer ring.    
     
     
         2 . The carrier of  claim 1 , wherein said snap fit mechanism comprises a raised structure defined on said inner surface and a receptacle defined on said side surface into which said raised structure fits.  
     
     
         3 . The carrier of  claim 1 , wherein said snap fit mechanism comprises a raised structure defined on said side surface and a receptacle defined on said inner surface into which said raised structure fits.  
     
     
         4 . The carrier of  claim 1 , wherein said retainer ring and said carrier body comprise an annular dimension.  
     
     
         5 . The carrier of  claim 1 , wherein said retainer ring is secured to said carrier body without the need for employing screws or an adhesive.  
     
     
         6 . The carrier of  claim 1 , wherein a cross-section of said retainer ring depicts an L-shaped structure.  
     
     
         7 . The carrier of  claim 1 , wherein said first portion comprises an axis that is transverse to an axis of said second portion.  
     
     
         8 . The carrier of  claim 7 , wherein said first portion is perpendicular to said second portion.  
     
     
         9 . The carrier of  claim 1 , wherein said front surface and said back surface is circular and wherein said retainer ring is ring-shaped.  
     
     
         10 . The carrier of  claim 1 , wherein said carrier body comprises a portal to deliver and remove air from a space defined between said membrane and said front surface.  
     
     
         11 . The carrier of  claim 1 , wherein said membrane comprises an outer edge onto which said front portion applies force to secure said membrane to said carrier body.  
     
     
         12 . A carrier for use with an integrated circuit wafer comprising: 
 a carrier body comprising a front surface, a back surface and a side surface;    a retainer ring comprising a first portion sized and configured for positioning on a portion of said front surface and having a second portion attached to or integrated with said first portion, said second portion comprising an inner surface sized and configured for positioning on all or a portion of said side surface, wherein said second portion is engaged to said side surface; and    a membrane covering a portion of said front surface and secured to said carrier body by said retainer ring.