Method of producing mold used in production of hydrophobic polymer substrate

Abstract

Disclosed is a method of producing a mold for preparing a hydrophobic polymer substrate including forming an adhesion enhancer on a substrate, forming a first conductive layer on the adhesion enhancer, adhering a predetermined patterned hydrophobic template on the first conductive layer, forming a second conductive layer on the template to prepare a template assembly, metal electroplating on the template assembly to form a metal plating layer on the template assembly, and removing the first conductive layer, the second conductive layer, the adhesion enhancer, and the template from the template assembly.

1 . A method of producing a mold for producing a hydrophobic polymer substrate, comprising; 
 forming an adhesion enhancer on a substrate;    forming a first conductive layer on the adhesion enhancer;    adhering a predetermined patterned hydrophobic template on the first conductive layer;    forming a second conductive layer on the template and on the first conductive layer to prepare a template assembly;    metal electroplating on the template assembly to form a metal plating layer on the template assembly to produce a metal plated template assembly;    removing the template assembly from the metal plated template assembly to separate the template assembly and the metal plating layer.    
   
   
       2 . The method of  claim 1 , wherein the adhesion enhancer is formed by depositing on the substrate a material selected from the group consisting of Cr and Ti.  
   
   
       3 . The method of  claim 1 , wherein the first conductive layer is formed by sputtering on the adhesion enhancer a conductive material selected from the group consisting of gold, copper, and nickel.  
   
   
       4 . The method of  claim 1 , wherein the second conductive layer is formed by gold or carbon ionic coating.  
   
   
       5 . The method of  claim 1 , wherein the hydrophobic template is a hydrophobic leaf.  
   
   
       6 . The method of  claim 5 , wherein the hydrophobic leaf is a leaf of one or more selected from the group consisting of bamboo, lovegrass, trident maple, and tulip plant.  
   
   
       7 . The method of  claim 1 , wherein the metal electroplating is a nickel electroplating.  
   
   
       8 . The method of  claim 7 , wherein the nickel electroplating is performed by using a nickel plating solution including 200 to 330 g/L of nickel sulfamate, 30 to 60 g/L of nickel chloride, and 30 to 60 g/L of boric acid.  
   
   
       9 . The method of  claim 8 , wherein the nickel plating is performed at 50 to 55° C., a pH of 3.8 to 4.5, and a current density of 0.37 to 1.20 mA/dm 2 .