Imaging device and method of manufacture

Abstract

An imaging chip is packaged in transparent injection molded material. The chip may have photosensitive elements arranged in a two-dimensional array on semiconductor material. Each element corresponds to a pixel of an image. The package may be formed of epoxy resin. In one aspect of the invention, the transparent plastic material provides a color filter. Second and third packages with complementary color filters may be used to provide signals for a color imaging system. In another aspect of the invention, a lens is integrated into the plastic package. In another aspect of the invention, a semiconductor chip is applied to a pre-formed plastic package by bump bonding.

1 - 31 . (canceled)  
   
   
       32 . A method of making an image device, comprising the steps of: 
 locating a semiconductor device in a mold, said device including an integrated circuit and photosensitive elements;    attaching leads to said semiconductor device;    locating a color filter array in said mold;    injecting a transparent thermosetting resin into said mold such that said integrated circuit and said photosensitive elements are covered by said transparent resin;    curing said thermosetting resin to form a package encapsulating said semiconductor device, said package providing a color filter in said transparent resin.    
   
   
       33 . A method of making an image device, comprising the steps of: 
 locating a semiconductor device in a mold, said device including an integrated circuit and photosensitive elements;    locating a color filter array in said mold;    injecting transparent resin into said mold such that said integrated circuit, said photosensitive elements, and said color filter array are covered by said transparent resin; and    subsequently, removing said semiconductor device from said mold.    
   
   
       34 . The method of  claim 33 , further comprising the steps of attaching leads to said semiconductor device, said leads being partially encapsulated in said transparent resin.  
   
   
       35 . The method of  claim 34 , wherein said transparent resin is a thermosetting resin, and further comprising the step of curing said thermosetting resin to form a package encapsulating said semiconductor device.  
   
   
       36 . The method of  claim 35 , further comprising the step of forming a lens in said package.