Indirect-direct evaporative cooling system operable from sustainable energy source
Abstract
Improved means for powering and increasing evaporative cooling in an indirect-direct evaporative cooling (IDEC) apparatus are disclosed. Sustainable energy from solar energy mixed with grid power, when needed, power the IDEC device. These DC and AC power sources are seamlessly merged in a unique diode interconnect unit. Improved means for evaporative cooling include a rayon-based flocking on the wet side of molded plastic indirect evaporative cooling plates. Separate wet and dry passages through those plates are facilitated by a unique means for clamping the upper ends of the plates. These clamping means also add to the structural integrity of an array of plates so that the array can be inserted in and removed from a housing containing other operational components of the IDEC such as fan, direct cooling plates and water distribution means. Applicants IDEC utilizes improved porous piping that allows uniform and continuous distribution of water to all wet passages within both the indirect and direct stages of the IDEC. Operational controls for the system limit the potential water damage caused by overflow of water from the IDEC housing.
Claims
exact text as granted — not AI-modified1 - 5 . (canceled)
6 . A hydrophilic coating for a heat exchange plate useable in the indirect evaporative cooling stage of indirect-direct evaporative cooling (IDEC) system comprising a flocked rayon-based material deposited on the plate.
7 . The hydrophilic coating of claim 6 comprising a random cut rayon material deposited on the plate.
8 . The hydrophilic coating of claim 6 wherein the rayon material is random cut and has an approximate average length of about 0.020 inches.
9 . The hydrophilic coating of claim 7 wherein the rayon material has an approximate pile height of about 0.005 inches.
10 . The hydrophilic coating of claim 6 wherein the coating is attached to the plate with an adhesive.
11 . The hydrophilic coating of claim 10 wherein the adhesive is a vinyl acetate monomer.
12 . A fluid delivery device for releasing fluid useable for evaporative cooling of a gas is an evaporative cooling apparatus comprising a porous container for such fluid located above the evaporative cooling apparatus.
13 . The fluid delivery device of claim 12 wherein the porous container is located above:
a) the indirect cooling stage of an indirect-direct evaporative cooling (IDEC) system; b) the direct cooling stage of an IDEC system; or c) both the indirect and direct stage of the IDEC system.
14 . The fluid delivery device of claim 12 wherein the porous container is porous plastic piping.
15 . The fluid delivery device of claim 14 wherein the porous container is porous high density polyethylene piping.
16 . The fluid delivery device of claim 12 wherein the porous container is in physical contact with the evaporative cooling apparatus to promote uniform discharge of the fluid into the cooling apparatus.
17 . An indirect-direct evaporative cooling (IDEC) apparatus comprising
a) a unitary molded housing; b) an outside air entrance into the housing; c) a fan for moving outside air through the housing; d) a direct evaporative cooling stage within the housing for evaporative cooling of outside air; e) an indirect evaporative cooling stage within the housing for evaporative cooling of outside air comprising an array of multiple parallel plates, one side of the plate being wetted during operation and the other side being essentially dry, and f) U-shaped clamps arranged to selectively close portions of the parallel plates to create wet and dry passages through the plates.
18 . The IDEC apparatus of claim 17 wherein the U-shaped clamps are formed from a hardened, corrosion resistant material.
19 . The IDEC apparatus of claim 18 wherein the U-shaped clamps are stainless steel.
20 . The IDEC apparatus of claim 18 wherein the U-shaped clamps are aluminum.Cited by (0)
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