US2007018538A1PendingUtilityA1

Film bulk acoustic resonator (FBAR) with high thermal conductivity

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Assignee: WANG LI-PENGPriority: Jun 26, 2003Filed: Sep 28, 2006Published: Jan 25, 2007
Est. expiryJun 26, 2023(expired)· nominal 20-yr term from priority
Inventors:Li-Peng Wang
H03H 9/02102H03H 9/564
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Claims

Abstract

The specification discloses embodiments of an apparatus comprising a film bulk acoustic resonator (FBAR) filter comprising a piezoelectric membrane having a portion thereof sandwiched between a first electrode and a second electrode, the piezoelectric membrane being suspended from at least two edges thereof, and a heat transfer layer placed on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Also disclosed are embodiments of a process comprising sandwiching a portion of the piezoelectric membrane between a first electrode and a second electrode, suspending a piezoelectric membrane from at least two edges thereof, and placing a heat transfer layer on the piezoelectric membrane surrounding, but not in contact with, the first electrode. Other embodiments are disclosed and claimed.

Claims

exact text as granted — not AI-modified
1 . A process comprising: 
 sandwiching a portion of the piezoelectric membrane between a first electrode and a second electrode;    suspending a piezoelectric membrane from at least two edges thereof; and    placing a heat transfer layer on the piezoelectric membrane surrounding, but not in contact with, the first electrode.    
   
   
       2 . The process of  claim 1  wherein suspending the piezoelectric membrane comprises suspending the membrane over a substrate between at least two supports connected to the substrate.  
   
   
       3 . The process of  claim 1  wherein placing the heat transfer layer on the piezoelectric membrane comprises screen printing the heat transfer layer thereon.  
   
   
       4 . The process of  claim 1  wherein placing the heat transfer layer on the piezoelectric membrane comprises electroplating the heat transfer layer thereon.  
   
   
       5 . The process of  claim 1  wherein placing the heat transfer layer on the piezoelectric membrane comprises solder plating the heat transfer layer thereon.  
   
   
       6 . The process of  claim 1 , further comprising attaching a plate to the heat transfer layer along the edges of the membrane, the cap covering the membrane.  
   
   
       7 . The process of  claim 1 , further comprising attaching a second plate to a second side of the membrane along the edges thereof.

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