High pressure pump for cooling electronics

Abstract

A pump includes a shaft, a first electric motor associated with first portion of the shaft, a second electric motor associated with a second portion of the shaft, and a position sensor associated with a third portion of the shaft. A controller commutates the first electric motor and the second electric motor to rotate the shaft and maintain a substantially equal distance between the sensor and the shaft.

1 . A pump comprising: 
 a shaft;    a first electric motor associated with first portion of the shaft;    a second electric motor associated with a second portion of the shaft;    a position sensor associated with a third portion of the shaft; and    a controller for commutating the first electric motor and the second electric motor to rotate the shaft and maintain a distance between the sensor and the shaft substantially within a selected range.    
   
   
       2 . The pump of  claim 1 , further comprising rotor attached to the shaft.  
   
   
       3 . The pump of  claim 1 , further comprising: 
 rotor attached to the shaft;    a housing for the rotor, the housing having an inlet and an outlet, the rotor rotating within the housing to move a fluid from the inlet to the outlet.    
   
   
       4 . The pump of  claim 1 , further comprising: 
 a first catcher positioned about a fourth portion of the shaft; and    a second catcher positioned about a fifth portion of the shaft, the first catcher and the second catcher supporting the shaft when the pump is in a non-operating mode.    
   
   
       5 . The pump of  claim 4 , wherein the shaft includes: 
 a first collar positioned on the fourth portion of the shaft; and    a second collar positioned on the fifth portion of the shaft, the first collar and the second collar adapted to interact with the first catcher and the second catcher when the pump is in the non-operating mode.    
   
   
       6 . The pump of  claim 5 , wherein the first catcher includes a set of sidewalls to limit motion of the first collar positioned on the fourth portion of the shaft.  
   
   
       7 . The pump of  claim 4 , further comprising a casing for housing the shaft, the first catcher, the second catcher, the position sensor and a portion of the first electric motor and the second electric motor.  
   
   
       8 . The pump of  claim 7  wherein a stator of the first electric motor and a stator of the second electric motor are positioned outside the casing.  
   
   
       9 . The pump of  claim 8  wherein the controller controls the a portion of the first electric motor and a portion of the second electric motor are positioned outside the casing.  
   
   
       10 . The pump of  claim 1 , further comprising: 
 a gear driver rotor attached to the shaft;    a gear driven rotor engaged with the gear driver rotor, the gear driven rotor and gear driver rotor positioned within a housing.    
   
   
       11 . The pump of  claim 1  wherein output from the position sensor is fed back to the controller for use in commutating the first electric motor and the second electric motor to rotate the shaft and maintain a substantially equal distance between the sensor and the shaft.  
   
   
       12 . A thermal solution system comprising: 
 a cold plate;    a coolant in fluid communication with the cold plate; and    a pump for moving the coolant through the cold plate, the pump further comprising: 
 a shaft;  
 a first electric motor associated with first portion of the shaft;  
 a second electric motor associated with a second portion of the shaft;  
 a position sensor associated with a third portion of the shaft; and  
 a controller for commutating the first electric motor and the second electric motor to rotate the shaft and maintain a substantially equal distance between the sensor and the shaft.  
   
   
   
       13 . The thermal solution system of  claim 12 , further comprising a semiconductor device, wherein the cold plate is in thermal communication with the semiconductor.  
   
   
       14 . The thermal solution system of  claim 12 , wherein the cold plate includes a plurality of channels.  
   
   
       15 . The thermal solution system of  claim 12 , wherein the cold plate includes a plurality of openings having a dimension in the range of 2 mm to 8 mm .  
   
   
       16 . The thermal solution system of  claim 12 , further comprising: 
 a semiconductor device, wherein the cold plate is in thermal communication with the semiconductor; and    a passageway for the coolant, the passageway including a loop wherein the pump and the cold plate are in the loop.    
   
   
       17 . The thermal solution system of  claim 16 , further comprising a plurality of fins attached to at least one portion of the loop, the fins for cooling the coolant within the loop.  
   
   
       18 . The thermal solution system of  claim 17 , further comprising a fan positioned to direct a flow of air past the plurality of fins.  
   
   
       19 . The thermal solution system of  claim 16 , wherein the semiconductor device is a microprocessor.  
   
   
       20 . The thermal solution system of  claim 12  wherein the pump further comprises: 
 rotor attached to the shaft;    a housing for the rotor, the housing having an inlet and an outlet, the rotor rotating within the housing to move a fluid from the inlet to the outlet.    
   
   
       21 . The thermal solution system of  claim 12 , wherein the pump further comprises: 
 a first catcher positioned about a fourth portion of the shaft; and    a second catcher positioned about a fifth portion of the shaft, the first catcher and the second catcher supporting the shaft when the pump is in a non-operating mode.    
   
   
       22 . The thermal solution system of  claim 21 , wherein the shaft of the pump includes: 
 a first collar positioned on the fourth portion of the shaft; and    a second collar positioned on the fifth portion of the shaft, the first collar and the second collar adapted to interact with the first catcher and the second catcher when the pump is in the non-operating mode.    
   
   
       23 . The system of  claim 12 , wherein the pump further comprises: 
 a gear driver rotor attached to the shaft;    a gear driven rotor engaged with the gear driver rotor, the gear driven rotor and gear driver rotor positioned within a housing.    
   
   
       24 . A method for pumping a fluid comprising: 
 commutating a first motor attached to a shaft; and    commutating a second motor attached to the same shaft as the first, wherein the commutation of the first motor and the second motor rotates and levitates the shaft.    
   
   
       25 . The method of  claim 24  further comprising limiting the motion of the shaft when in a non-operational mode.  
   
   
       26 . The method of  claim 24  further comprising limiting the motion of the shaft when in an operational mode.  
   
   
       27 . The method of  claim 24  further comprising: 
 sensing the position of the shaft as the shaft rotates; and    feeding back position information to control the commutation of the first motor and the second motor.    
   
   
       28 . A system comprising: 
 a central processing unit;    a thermal solution in thermal communication with the central processing unit, the thermal solution including a pump further comprising: 
 a shaft;  
 a first electric motor associated with first portion of the shaft;  
 a second electric motor associated with a second portion of the shaft;  
 a position sensor associated with a third portion of the shaft; and  
 a controller for commutating the first electric motor and the second electric motor to rotate the shaft and maintain a substantially equal distance between the sensor and the shaft; and  
   a display in electrical communication with the central processing unit, the display receiving input from the central processing unit.    
   
   
       29 . The system of  claim 28  wherein the thermal solution further comprises: 
 a cold plate attached to the central processing unit; and    a coolant in fluid communication with the cold plate, wherein the pump moves the coolant through the cold plate.    
   
   
       30 . The thermal solution system of  claim 29 , wherein the cold plate includes a plurality of channels.