US2007023386A1PendingUtilityA1

Hollow microneedle array

48
Individually held — no corporate assignee on recordPriority: Sep 8, 2004Filed: Oct 4, 2006Published: Feb 1, 2007
Est. expirySep 8, 2024(expired)· nominal 20-yr term from priority
Inventors:Stanley H. KravitzDavid IngersollCarrie SchmidtJeb H. Flemming
A61M 37/0015C03C 15/00C03C 23/007C23F 1/00B81B 2201/055B81C 1/00111A61M 2037/0053C03C 23/002
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Claims

Abstract

An inexpensive and rapid method for fabricating arrays of hollow microneedles uses a photoetchable glass. Furthermore, the glass hollow microneedle array can be used to form a negative mold for replicating microneedles in biocompatible polymers or metals. These microneedle arrays can be used to extract fluids from plants or animals. Glucose transport through these hollow microneedles arrays has been found to be orders of magnitude more rapid than natural diffusion.

Claims

exact text as granted — not AI-modified
1 . A hollow microneedle array, comprising at least one hollow microneedle comprising a photoetchable glass, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension.  
   
   
       2 . The array of  claim 1 , wherein the photoetchable glass comprises a lithium-aluminum-silicate glass containing silver and germanium ions.  
   
   
       3 . The array of  claim 1 , wherein the at least one hollow microneedle is perpendicular to a photoetchable glass wafer.  
   
   
       4 . The array of  claim 1 , wherein the height of the at least one hollow microneedle is less than 1 millimeter.  
   
   
       5 . The array of  claim 1 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 25 microns.  
   
   
       6 . The array of  claim 1 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.  
   
   
       7 . The array of  claim 1 , wherein the bore is offset from the center of the tip.  
   
   
       8 . The array of  claim 1 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.  
   
   
       9 . The array of  claim 1 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of less than 300 microns.  
   
   
       10 . A hollow microneedle array, comprising at least one hollow microneedle comprising a polymer, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension.  
   
   
       11 . The array of  claim 10 , wherein the polymer comprises a cast polymer.  
   
   
       12 . The array of  claim 10 , wherein the polymer comprises a hot embossed polymer.  
   
   
       13 . The array of  claim 10 , wherein the polymer comprises an injection molded polymer.  
   
   
       14 . The array of  claim 10 , wherein the height of the at least one hollow microneedle is less than 1 millimeter.  
   
   
       15 . The array of  claim 10 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 25 microns.  
   
   
       16 . The array of  claim 10 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.  
   
   
       17 . The array of  claim 10 , wherein the bore is offset from the center of the tip.  
   
   
       18 . The array of  claim 10 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.  
   
   
       19 . The array of  claim 10 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of less than 300 microns.  
   
   
       20 . A hollow microneedle array, comprising at least one hollow microneedle comprising a metal, wherein the at least one hollow microneedle has a height, a bore with a cross-sectional dimension, and a tip with a cross-sectional dimension.  
   
   
       21 . The array of  claim 20 , wherein the metal comprises an electroplated metal.  
   
   
       22 . The array of  claim 20 , wherein the metal comprises nickel, copper, or gold.  
   
   
       23 . The array of  claim 20 , wherein the height of the at least one hollow microneedle is less than 1 millimeter.  
   
   
       24 . The array of  claim 20 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 25 microns.  
   
   
       25 . The array of  claim 20 , wherein the bore of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.  
   
   
       26 . The array of  claim 20 , wherein the bore is offset from the center of the tip.  
   
   
       27 . The array of  claim 20 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of greater than 100 microns.  
   
   
       28 . The array of  claim 20 , wherein the tip of the at least one hollow microneedle has a cross-sectional dimension of less than 300 microns.

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