US2007028730A1PendingUtilityA1
Apparatus and methods for double ended processing
Est. expiryAug 20, 2023(expired)· nominal 20-yr term from priority
B23D 59/008B23D 59/001B27M 1/08Y10T83/2033Y10T83/145Y10T83/04Y10T83/155
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Claims
Abstract
System, including apparatus and method, involves processing materials in opposite directions between two machines along a processing path.
Claims
exact text as granted — not AI-modified1 . A method of cutting material comprising
connecting a computer to a saw machine, the computer being programmed to optimize cutting of stock to satisfy a cut list, measuring a piece of material to be cut, marking defects in the piece of material by signaling location of the defect without affixing an actual mark on the piece of material, automatically calculating a plan for optimal cutting of the piece of material to fulfill cut list requirements, executing the plan including automatically pushing the piece of material toward the saw, and cutting the piece of material according to the plan into one or more cut list part, and automatically printing labels for the cut list parts, each label indicating information about the part.
2 . The method of claim 1 wherein the marking step includes the step of deflecting a light beam at a location near a defect in the piece of material.
3 . The method of claim 1 further comprising
activating a visible signal in relation to the marking step, informing a user of a feature location.
4 . The method of claim 1 wherein the marking step includes the steps of positioning an object proximally and distally relative to a defect.
5 . The method of claim 4 wherein the marling step is carried out by a marking system including an object for marking location of defects, the object being slidable along a track parallel to the direction of material processing.Join the waitlist — get patent alerts
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