Method for polishing diamond wafers

Abstract

A method for polishing diamond wafers. At least a diamond wafer is mounted onto a ceramic plate with wax disposed therebetween and is pressed onto the ceramic plate. The ceramic plate is fixed on a first transmission device of a polishing machine by a vacuum. The ceramic plate is driven by the first transmission device to rotate and move towards a metal disc fixed on a second transmission device driven to rotate unmoved such that the diamond wafer on the ceramic plate is being polished by the metal disc. The method for polishing diamond wafers of the present invention uses the metal disc so as to reduce cost, time and improve polishing efficiency.

1 . A method for polishing diamond wafers, comprising steps of: 
 providing at least a diamond wafer fixed on a plate;    fixing said plate onto a first transmission device of a polishing machine such that a surface of said diamond wafer faces a metal disc fixed onto a second transmission device of said polishing machine; and    rotating said metal disc driven by said second transmission device and rotating said plate driven by said first transmission device to move towards said metal disc so as to polish said diamond wafer fixed on said plate.    
   
   
       2 . The method as recited in  claim 1 , wherein said plate is a ceramic plate.  
   
   
       3 . The method as recited in  claim 1 , wherein said diamond wafer is mounted on said plate with wax disposed therebetween and is pressed to be fixed on said plate.  
   
   
       4 . The method as recited in  claim 1 , wherein said plate is fixed on said transmission device by a vacuum.  
   
   
       5 . The method as recited in  claim 1 , wherein said metal disc is made of steel or an alloy thereof.  
   
   
       6 . The method as recited in  claim 1 , wherein said polishing machine comprising a control unit with input polishing parameters so as to control said first transmission device and said second transmission device for determining the wafer thickness and polishing time.  
   
   
       7 . The method as recited in  claim 1 , wherein said metal disc is driven and controlled by said second transmission device to rotate unmoved and said plate is driven and controlled by said first transmission device to rotate moving towards said metal disc so as to polish said diamond wafer.  
   
   
       8 . The method as recited in  claim 1 , wherein said plate is driven and controlled by said first transmission device to rotate moving towards said metal disc for a first interval of time and moving away from said metal disc for a second interval of time.  
   
   
       9 . The method as recited in  claim 1 , wherein said plate is driven and controlled by said first transmission device to repeat moving towards said metal disc and moving away from said metal disc.  
   
   
       10 . The method as recited in  claim 1 , wherein said plate is driven and controlled by said first transmission device to move towards said metal disc and move perpendicularly to a direction towards said metal disc.  
   
   
       11 . The method as recited in  claim 1 , wherein said plate is driven and controlled by said first transmission device to rotate and move towards said metal disc.  
   
   
       12 . The method as recited in  claim 1 , wherein said metal disc is driven by said second transmission device controlled by said control unit to move back and forth and move perpendicularly to a direction towards said plate.  
   
   
       13 . The method as recited in  claim 1 , wherein said polishing machine comprises at least a cooling liquid outlet for ejecting a cooling liquid so as to rinse and cool down said metal disc and said diamond wafer.