High performance cooling assembly for electronics

Abstract

An assembly for high performance cooling of electronics is described that includes a container for heat transfer liquid in which complex electronic assemblies are immersed. The electronics are sealed inside the liquid container such that an electrical connector protrudes to the exterior of the container. A thermally conductive plate is made part of the liquid filled container assembly such that a portion of the plate is in contact with the liquid and a portion of the plate protrudes from or forms part of the exterior of the container.

1 . A liquid cooled electronics circuit board, comprising 
 a circuit board comprising a plurality of heat generating components;    a sealed container surrounding said circuit board and containing a heat transfer, dielectric liquid such that said circuit board is substantially submerged in said liquid, wherein said container comprises a fill port, at least one heat conductive plate that is in contact with said liquid and protrudes to the exterior of said container, and a thermal expansion compensating surface; and    an electrical connector connecting to said circuit board and extending to the exterior of said container.    
     
     
         2 . The liquid cooled electronics circuit board of  claim 1 , wherein said circuit board is installed in a computer system.  
     
     
         3 . The liquid cooled electronics circuit board of  claim 1 , wherein the volume of said liquid is at least 50 ml.  
     
     
         4 . The liquid cooled electronics circuit board of  claim 1 , wherein said heat generating components together generate 20-150 watts.  
     
     
         5 . The liquid cooled electronics circuit board of  claim 1 , wherein said heat generating components together generate 50-100 watts.  
     
     
         6 . The liquid cooled electronics circuit board of  claim 1 , wherein thermal expansion volume of said liquid within said container is accommodated by a flexible diaphragm that is in contact with the liquid on one side and ambient atmosphere on the other side.  
     
     
         7 . The liquid cooled electronics circuit board of  claim 6 , wherein said flexible diaphragm is a low curvature, concave wall of said container.  
     
     
         8 . The liquid cooled electronics circuit board of  claim 6 , wherein said flexible diaphragm is a circular disk diaphragm.  
     
     
         9 . The liquid cooled electronics circuit board of  claim 1 , wherein said heat conductive plate is adjacent said connector.  
     
     
         10 . The liquid cooled electronics circuit board of  claim 1 , wherein said heat conductive plate is distal from said connector.  
     
     
         11 . The liquid cooled electronics circuit board of  claim 1 , wherein said liquid is a fluorocarbon or an oil.  
     
     
         12 . The liquid cooled electronics circuit board of  claim 1 , wherein said container can be opened or removed allowing access to components on said circuit board, and sealably replaced.  
     
     
         13 . The liquid cooled electronics circuit board of  claim 1 , wherein said fill port is configured to allow extraction and replacement of said liquid.  
     
     
         14 . The liquid cooled electronics circuit board of  claim 1 , wherein said heat conductive plate is thermally coupled with a heat sink.  
     
     
         15 . The liquid cooled electronics circuit board of  claim 14 , wherein the thermal coupling is accomplished through a heat conductive elastomeric material.  
     
     
         16 . An electronics cooling assembly, comprising 
 a sealed container substantially filled with a heat transfer, non-electrically conducting liquid and comprising a fill port allowing filling of said container with said liquid after sealing, at least one conductive plate that is in contact with the liquid inside the container, and protrudes to the exterior of the container, and a thermal expansion compensating surface;    at least one circuit board mounted within said container substantially submerged in said liquid; and    an electrical connector connecting to said circuit board and extending to the exterior of the container.    
     
     
         17 . The electronics cooling assembly of  claim 16 , wherein the walls of said container consist essentially of a material selected from the group consisting of polycarbonate, acrylic, and ABS plastic.  
     
     
         18 . The electronics cooling assembly of  claim 16 , wherein said fill port comprises an orifice that can be breached by a nozzle and is self-sealing when the nozzle is retracted.  
     
     
         19 . The electronics cooling assembly of  claim 16 , wherein said heat conductive plate comprises at least 80% copper, aluminum, or heat conductive ceramic.  
     
     
         20 . The electronics cooling assembly of  claim 16 , wherein thermal expansion volume of said liquid within said container is accommodated by a flexible diaphragm that is in contact with the liquid on one side and ambient atmosphere on the other side.  
     
     
         21 . The electronics cooling assembly of  claim 20 , wherein said flexible diaphragm is a low curvature, concave wall of said container.  
     
     
         22 . The electronics cooling assembly of  claim 20 , wherein said flexible diaphragm is a circular disk diaphragm.  
     
     
         23 . The electronics cooling assembly of  claim 16 , wherein said liquid is a fluorocarbon or an oil.  
     
     
         24 . A computer system comprising 
 a plurality of electronics cooling assemblies, wherein each said cooling assembly comprises    a sealed container substantially filled with a heat transfer, non-electrically conducting liquid and comprising a fill port allowing filling of said container with said liquid after sealing, at least one conductive plate that is in contact with the liquid inside the container, and protrudes to the exterior of the container, and a thermal expansion compensating surface;    a circuit board mounted within said container substantially submerged in said liquid; and    an electrical connector connecting to said circuit board that protrudes to the exterior of said container.    
     
     
         25 . A method for cooling a complex electronics assembly, comprising 
 enclosing said complex electronic assembly in a sealed container substantially filled with a heat transfer, non-electrically conducting liquid and comprising a fill port allowing filling of said container with said liquid after sealing, at least one conductive plate that is in contact with the liquid inside the container, and protrudes to the exterior of the container, a thermal expansion compensating surface, and an electrical connector connecting to said circuit board and extending to the exterior of said container.    
     
     
         26 . The method of  claim 25 , further comprising thermally coupling said conductive plate with a heat transfer device.  
     
     
         27 . A method for thermally coupling a thermally conductive plate that conducts heat from an electronic assembly, with a thermally conductive device, comprising 
 mechanically compressing a thermally conductive compliant material between said thermally conductive plate and said thermally conductive device, wherein an electronic connector connected with said electronic assembly is mounted adjacent to or penetrates said thermally conductive plate.    
     
     
         28 . The method of  claim 27 , wherein said mechanical compression is performed using at least one over-center clamp.  
     
     
         29 . A cooling assembly for heat generating electronics, comprising 
 a first thermally conductive plate which conducts heat from said heat generating electronics;    a second thermally conductive element attached to a surface of said thermally conductive plate using a means for providing a low thermal resistance connection between the conductive plate and second heat transfer element, and    a first electronics connector adjacent to or penetrating said first thermally conductive plate which connects said heat generating electronics with separate electronic components.    
     
     
         30 . The cooling assembly of  claim 29 , wherein said means for providing a low thermal resistance connection comprises a high thermal conductance elastomer and an over-center clamping mechanism.  
     
     
         31 . The cooling assembly of  claim 29 , further comprising a second electronic connector mounted on said second thermally conductive element which connects with said first electronic connector.