Electronic cards and methods for making same
Abstract
An electronic card includes a digital processor, an electrochemical battery and a communications port. The processor and battery are essentially coplanar, and are sandwiched between and enclosed by two flexible covers, preferably made from an insulating plastic material, and preferably fitted to the components that they enclose. The communications port can include, for example, a Smart Card contact port, a stripe emulator, an RF port, and IR port, etc. The battery may comprise a rechargeable battery. In an exemplary embodiment, at least the processor is carried by a flexible printed circuit (PC) board. In other exemplary embodiments, switches and/or indicators are also carried by the PC board. A method for manufacturing an electronic card having at least two components is also disclosed.
Claims
exact text as granted — not AI-modified1 . An electronic card comprising:
a thin, flat digital processor having a first substantially planar surface and a substantially opposing second substantially planar surface, wherein at least one of said first surface, said second surface, and a cross-section of said processor define a maximum surface area; a thin, flat electrochemical battery having a first substantially planar surface and a substantially opposing second substantially planar surface, wherein at least one of said first surface, said second surface, and a cross-section of said processor define a maximum surface area, said battery being positioned substantially co-planar with said processor and capable of powering said processor; a communications port coupled to said processor; a first flexible cover and an opposing second flexible cover, each having card a surface area greater than the combined maximum surface areas of said digital processor and said battery; wherein said processor and said battery are sandwiched between and enclosed by said first flexible cover and said second flexible cover.
2 . An electronic card as recited in claim 1 further comprising a flexible circuit board including a plurality of traces, wherein said processor is electrically coupled to traces of said circuit board.
3 . An electronic card as recited in claim 2 wherein said circuit board is no thicker than about 10 mils.
4 . An electronic card as recited in claim 2 wherein said battery can be electrically coupled to said circuit board.
5 . An electronic card as recited in claim 2 wherein at least said processor is encapsulated.
6 . An electronic card as recited in claim 2 further comprising an encapsulant substantially covering said circuit board, processor and battery.
7 . An electronic card as recited in claim 2 wherein at least one of said first cover and said second cover are contoured to fit over said circuit board, processor and battery.
8 . An electronic card as recited in claim 2 wherein said communication port is coupled to said circuit board.
9 . An electronic card as recited in claim 2 further comprising a switch coupled to said circuit board.
10 . An electronic card as recited in claim 9 wherein said switch is a power switch.
11 . An electronic card as recited in claim 9 wherein a plurality of switches are coupled to said circuit board.
12 . An electronic card as recited in claim 2 further comprising an indicator coupled to said circuit board.
13 . An electronic card as recited in claim 12 wherein said indicator is an LED.
14 . An electronic card as recited in claim 12 wherein a plurality of indicators are coupled to said circuit board.
15 . An electronic card as recited in claim 2 wherein said processor is electrically coupled to traces of said circuit board in a flip-chip fashion.
16 . An electronic card as recited in claim 2 wherein said processor is electrically coupled to traces of said circuit board by wires bonded at a first end to said circuit board and bonded at a second end to said processor.
17 . An electronic card as recited in claim 16 wherein said wires to not extend more than 5 mils above a surface of said processor to which they are bonded.
18 . An electronic card as recited in claim 1 wherein said battery is rechargeable.
19 . An electronic card as recited in claim 1 wherein said battery is not rechargeable.
20 . An electronic card as recited in claim 1 further comprising a capacitor coupled to said battery to provide additional charge storage.
21 . An electronic card as recited in claim 1 wherein said battery is no thicker than 20 mils.
22 . An electronic card as recited in claim 21 wherein said battery includes a plurality of batteries.
23 . An electronic card as recited in claim 22 wherein said battery includes a filter.
24 . A method for making an electronic card comprising:
making a flexible printed circuit board; attaching at least one processor to said printed circuit board; coupling at least one battery to said printed circuit board; encapsulating at least said one processor; making a top cover and a bottom cover; and sandwiching said printed circuit board, said processor and said battery between said top cover and said bottom cover.
25 . An enhanced Smart Card comprising:
a card body provided with an externally accessible card interface including a signal port, a power port, and a ground port; a secure processor disposed at least partially within said card body and coupled to said signal port, said power port, and said ground port; a general processor disposed at least partially within said card body, said general processor being coupled to a power source disposed at least partially within said card body and being operative to provide power to and communicate with said secure processor when said secure processor is being used in an enhanced Smart Card mode; and a non-contact communications port coupled to at least one of said secure processor and said general processor.
26 . A secure transaction card comprising:
a card body; a secure processor disposed at least partially within said card body; a general processor disposed at least partially within said card body; a power source disposed at least partially within said card body; and a non-contact communications port coupled to at least one of said secure processor and said general processor.
27 . A swipe emulating broadcaster system comprising:
a coil including an elongated core material and a winding having a plurality of turns around said core material; and a signal generator having a broadcaster driver signal coupled to said coil such that said coil provides a dynamic magnetic field which emulates the swiping of a magnetic stripe transaction card past a read head of a card reader.
28 . A swipe emulating broadcaster as recited in claim 27 wherein said signal generator includes a processor having a digital output and a signal processing circuit which converts said digital output to said broadcaster driver signal.
29 . A swipe emulating broadcaster system as recited in claim 27 wherein said signal generator is a digital signal processor.
30 . A swipe emulating broadcaster as recited in claim 27 wherein said coil one of a plurality of coils.
31 . A swipe emulating broadcaster as recited in claim 30 wherein at least one of said plurality of coils is a track coil.
32 . A swipe emulating broadcaster as recited in claim 30 wherein at least one of said plurality of coils is a cancellation coil.
33 . A swipe emulating broadcaster as recited in claim 27 wherein said coil comprises a wire wound around said core.
34 . A swipe emulating broadcaster as recited in claim 27 wherein said coil comprises a wire formed around said core by a process including at least the deposition of conductive material and the etching of said conductive material.
35 . A method for creating a low-loop bonding for thin profile applications comprising:
attaching a first surface of a fabricated semiconductor die to a first surface of a substrate having a plurality of substrate contact pads, such that a second surface of said die which opposes said first surface is exposed to provide access to a plurality of die contact pads; wire bonding a first end of a wire to a substrate contact pad; and wire bonding a second end of said wire to a die contact pad, such that the loop height of said wire is no greater that 5 mils above said second surface of said die, and no greater than 20 mils above said first surface of said substrate.Cited by (0)
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