Low temperature methods of bonding components and related structures

Abstract

Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.

1 . A metallically bonded structure comprising: 
 first and second components; and    a plurality of bonded metal particles providing bonding between the two components.    
   
   
       2 . A structure according to  claim 1  wherein each of the metal particles comprises a dielectric material coated in the metal.  
   
   
       3 . A structure according to  claim 1  wherein each of the bonded metal particles comprises a corroded layer thereon wherein the corroded layer of adjacent particles provides bonding therebetween.  
   
   
       4 . A structure according to  claim 3  wherein the corroded layer comprises an oxide of the metal.  
   
   
       5 . A structure according to  claim 3  wherein the corroded layer comprises a galvanically corroded layer.  
   
   
       6 . A structure according to  claim 1  wherein the first component comprises a substrate.  
   
   
       7 . A structure according to  claim 6  wherein the second component comprises one of a micro-electronic component, a micro-optical component, or a micro-mechanical component.  
   
   
       8 . A structure according to  claim 1  wherein adjacent metal particles are bonded at interfaces therebetween with voids remaining between metal particles.  
   
   
       9 . A structure according to  claim 8  wherein adjacent metal particles have a metal to metal contact at a bonding interface therebetween and wherein at least one of the metal particles comprises a dielectric layer on a portion thereof.  
   
   
       10 . A structure according to  claim 1  wherein adjacent metal particles are bonded by layers of corrosion thereon.  
   
   
       11 . A structure according to  claim 10  wherein the layers of corrosion comprise an oxide of the metal.  
   
   
       12 . A structure according to  claim 10  where the layers of corrosion comprise galvanic corrosion.  
   
   
       13 . A structure according to  claim 10  wherein the metal particles comprises a metal with high diffusion rate at room temperature.  
   
   
       14 . A structure according to  claim 13  wherein the metal particles comprise indium.  
   
   
       15 . A structure according to  claim 1  wherein the bonded metal particles comprises a first metal, the structure further comprising: 
 a plated layer comprising a second metal between bonded metal particles wherein the second metal and the first metal are different.    
   
   
       16 . A metallically bonded structure comprising: 
 first and second components; and    a metal layer between the first and second components wherein the metal layer provides bonding between the two components and wherein the metal layer extends onto a portion of the second component opposite the first component.    
   
   
       17 . A structure according to  claim 16  wherein the metal layer comprises a plurality of bonded metal particles.  
   
   
       18 . A structure according to  claim 16  wherein the metal layer includes dielectric particles therein.  
   
   
       19 . A structure according to  claim 16  wherein the metal layer comprises an amalgam.  
   
   
       20 . A structure according to  claim 19  wherein the amalgam comprises silver and mercury.  
   
   
       21 . A structure according to  claim 16  wherein the first component comprises a substrate.  
   
   
       22 . A structure according to  claim 21  wherein the second component comprises one of a micro-electronic component, a micro-optical component, or a micro-mechanical component.  
   
   
       23 . A micro-structure comprising: 
 a substrate;    a micro-component positioned relative to the substrate; and    a plurality of metal particles adjacent both the substrate and the micro-component.    
   
   
       24 . A micro-structure according to  claim 23  wherein the metal particles are bonded to one another.  
   
   
       25 . A micro-structure according to  claim 23  wherein at least one of the metal particles comprises a dielectric material surrounded by a metal layer.  
   
   
       26 . A micro-structure according to  claim 23  wherein at least one of the metal particles comprises a diffusion barrier thereon.  
   
   
       27 . A micro-structure according to  claim 26  wherein at least one of the metal particles comprises a first metal having a first diffusion rate and wherein the diffusion barrier comprises a surface layer of a second metal having a second diffusion rate wherein the first diffusion rate is higher than the second diffusion rate.  
   
   
       28 . A micro-structure according to  claim 26  wherein the diffusion barrier comprises a dielectric layer on the metal particle.  
   
   
       29 . A micro-structure according to  claim 28  wherein the diffusion barrier comprises an oxide layer.  
   
   
       30 . A micro-structure according to  claim 26  wherein the diffusion barrier comprises a layer of a material that sublimes at room temperature.  
   
   
       31 . A micro-structure according to  claim 30  wherein the material that sublimes at room temperature comprises one of carbon dioxide or naphthalene.  
   
   
       32 . A micro-structure according to  claim 23  wherein the metal particles comprise a metal that forms an amalgam when exposed to a dissimilar liquid metal species at a temperature less than the melting temperature of the metal.  
   
   
       33 . A micro-structure according to  claim 32  wherein the metal comprises silver.  
   
   
       34 . A micro-structure according to  claim 23  wherein the micro-component comprises one of a micro-electronic component, a micro-optical component, and/or a micro-mechanical component.