Processes for removing organic layers and organic electronic devices formed by the processes

Abstract

A process for protecting first electrodes, conductive leads and the underlying substrate from the process of removing organic layers during the fabrication of an organic electronic device. After first electrodes and conductive leads are formed over a substrate, a protective layer is selectively formed over the structure, with the protective layer not being disposed over selected portions of the first electrodes, the conductive leads and the substrate. Organic layers are then formed over the structure, and second electrodes are formed over the organic layers. Those portions of the organic layers disposed over the selected portions of the first electrodes, conductive leads and substrate are removed, and the protective layer protects adjacent portions of the first electrodes, conductive leads and substrate from the process of removing the portions of the organic layers.

1 . A process for forming an electronic device, comprising: 
 forming at least one first electrode over a substrate;    forming at least one conductive lead over the substrate, wherein the at least one conductive lead is laterally spaced apart from the at least one first electrode;    forming a protective layer of material over portions of the at least one first electrode and the at least one conductive lead, wherein one or more selected portions of the at least one first electrode and the at least one conductive lead are left exposed by the protective layer;    forming organic material over the protective layer and the one or more selected portions;    forming at least one second electrode over the organic material; and    removing portions of the organic material to at least partially expose the one or more selected portions.    
     
     
         2 . The process of  claim 1 , wherein the one or more selected portions include at least one portion of the at least one first electrode and at least one portion of the at least one conductive lead.  
     
     
         3 . The process of  claim 1 , wherein the at least one first electrode includes a pixel portion and an anode lead portion, wherein the anode lead portion further comprises a wire bonding pad area.  
     
     
         4 . The process of  claim 3 , wherein the one or more selected portions includes the pixel portion, the wire bonding pad area, or combinations thereof.  
     
     
         5 . The process of  claim 3 , wherein the formation of the protective layer includes: 
 forming the protective layer over the at least one first electrode and the at least one conductive lead; and    selectively removing portions of the protective layer over the one or more selected portions.    
     
     
         6 . The process of  claim 5 , wherein the selective removal of the protective layer further includes selectively removing a portion of the protective layer over the pixel portion of the at least one first electrode.  
     
     
         7 . The process of  claim 5 , wherein the selective removal of the protective layer over the one or more selected portions includes: 
 forming a photoresist material over the one or more selected portions before the formation of the protective layer; and    performing a photoresist material removal process, after the formation of the protective layer, for removing the photoresist material and portions of the protective layer disposed over the photoresist material.    
     
     
         8 . The process of  claim 1 , wherein the substrate is selected from a plastic substrate, a ceramic substrate, a glass substrate, a metal substrate, or combinations thereof.  
     
     
         9 . The process of  claim 1 , wherein: 
 the formation of the protective layer further includes forming the protective layer over the substrate, wherein a portion of the substrate is left exposed by the protective layer;    the formation of the organic material includes forming the organic material over the substrate; and    the removal of portions of the organic material includes removing a portion of the organic material to expose the portion of the substrate.    
     
     
         10 . The process of  claim 1 , wherein the removal of the portions of the organic material is performed using laser ablation, plasma etching, or combinations thereof.  
     
     
         11 . The process of  claim 1 , further comprising: 
 forming at least one conductive bridge member that extends between and electrically connects the at least one second electrode and the one or more selected portions of the at least one conductive lead.    
     
     
         12 . An organic electronic device made by the process of  claim 1 .  
     
     
         13 . The device of  claim 12 , wherein the device is selected from a light-emitting diode, a light-emitting diode display, a diode laser, a photodetector, a photoconductive cell, a photoresistor, a photoswitch, a phototransistor, a phototube, and IR detector, a photovoltaic device, a solar cell, a transistor, or a diode.