Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate

Abstract

A solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus including a jet head for ejecting a droplet of a solution containing fine particles onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, wherein the substrate has no liquid absorbing property, wherein the jet head includes a nozzle from which the droplet is ejected, the nozzle being formed from a material that has a greater hardness than that of the fine particles in the solution, wherein the nozzle has a size that is equal to or less than Φ20 μm, the nozzle satisfying a relation of 0.0001≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, wherein each of the fine particles has a size that is equal to or less than the roughness of a surface of the substrate.

1 - 14 . (canceled)  
   
   
       15 . A solution used for a solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus having a jet head for ejecting a droplet onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, the substrate having no liquid absorbing property, the jet head including a nozzle from which the droplet is ejected, the nozzle having a size that is equal to or less than Φ20 μm, the solution comprising: 
 fine particles where each of the fine particles has a size that is equal to or less than the roughness of a surface of the substrate, the fine particles satisfying a relation of 0.0001≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, and the fine particles having a hardness less than that of a material of the nozzle.    
   
   
       16 . A substrate used for a solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus having a jet head for ejecting a droplet of a solution containing fine particles onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, the jet head including a nozzle from which the droplet is ejected, the nozzle being formed from a material that has a greater hardness than that of the fine particles in the solution, the nozzle having a size that is equal to or less than Φ20 μm, the nozzle satisfying a relation of 0.0001≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, the substrate comprising: 
 an electrode area on which the wiring pattern is formed,    wherein the substrate has no liquid absorbing property,    wherein the substrate has a surface having a roughness that is equal to or greater than the size of each of the fine particles.    
   
   
       17 . The substrate as claimed in  claim 16 , wherein the electrode area is formed as a rectangular pattern, wherein a corner of the rectangular pattern is chamfered.  
   
   
       18 . The substrate as claimed in  claim 16 , wherein the electrode area is formed as a combination of rectangular patterns, wherein a corner of each of the rectangular patterns is chamfered.  
   
   
       19 . The substrate as claimed in  claim 16 , wherein the electrode area is formed as a rectangular pattern, wherein a corner of the rectangular pattern is covered with one or more round-shaped dots.  
   
   
       20 . The substrate as claimed in  claim 16 , wherein the electrode area is formed as a combination of rectangular patterns, wherein a corner of each of the rectangular patterns is covered with one or more round-shaped dots.  
   
   
       21 . The substrate as claimed in  claim 16 , wherein the electrode area is formed as a pattern of one or more round-shaped dots by ejecting a droplet of a solution containing fine particles onto the substrate, so as to form the pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate.  
   
   
       22 . The substrate as claimed in  claim 16 , wherein the wiring pattern is a strip-like pattern extending in parallel to two perpendicular directions, the strip-like pattern being formed of a combination of round-shaped dots.  
   
   
       23 . The substrate as claimed in  claim 16 , wherein the strip-like pattern has a portion that is bent in a right angle, wherein an outer area of the bent portion is formed as a curve.  
   
   
       24 . A substrate used for a solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus having a jet head for ejecting a droplet of a solution containing fine particles onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, the jet head including a nozzle from which the droplet is ejected, the nozzle being formed from a material that has a greater hardness than that of the fine particles in the solution, the nozzle having a size that is equal to or less than Φ20 μm, the nozzle satisfying a relation of 0.0001≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, the substrate comprising: 
 an electrode area on which the device is formed,    wherein the substrate has no liquid absorbing property,    wherein the substrate has a surface having a roughness that is equal to or greater than the size of each of the fine particles.    
   
   
       25 . The substrate as claimed in  claim 24 , wherein the electrode area is formed as a rectangular pattern, wherein a corner of the rectangular pattern is chamfered.  
   
   
       26 . The substrate as claimed in  claim 24 , wherein the electrode area is formed as a combination of rectangular patterns, wherein a corner of each of the rectangular patterns is chamfered.  
   
   
       27 . The substrate as claimed in  claim 24 , wherein the electrode area is formed as a rectangular pattern, wherein a corner of the rectangular pattern is covered with one or more round-shaped dots.  
   
   
       28 . The substrate as claimed in  claim 24 , wherein the electrode area is formed as a combination of rectangular patterns, wherein a corner of each of the rectangular patterns is covered with one or more round-shaped dots.  
   
   
       29 . The substrate as claimed in  claim 24 , wherein the electrode area is formed as a pattern of one or more round-shaped dots by ejecting a droplet of a solution containing fine particles onto the substrate, so as to form the pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate.  
   
   
       30 . The substrate as claimed in  claim 24 , wherein the device is a strip-like pattern extending in parallel to two perpendicular directions, the strip-like pattern being formed of a combination of round-shaped dots.  
   
   
       31 . The substrate as claimed in  claim 24 , wherein the strip-like pattern has a portion that is bent in a right angle, wherein an outer area of the bent portion is formed as a curve.  
   
   
       32 . A method for fabricating a wiring pattern or a device, the method comprising the steps of: 
 ejecting a droplet of a solution containing fine particles onto a substrate, by using a jet head;    vaporizing a volatile ingredient of the solution; and    allowing a solid component to remain on the substrate,    wherein the substrate has no liquid absorbing property,    wherein the jet head includes a nozzle from which the droplet is ejected, the nozzle being formed from a material that has a greater hardness than that of the fine particles in the solution,    wherein the nozzle has a size that is equal to or less than Φ20 μm, the nozzle satisfying a relation of 0.0001≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle,    wherein each of the fine particles has a size that is equal to or less than the roughness of a surface of the substrate.