Electronic product having airflow-guiding structure and method for fabricating the airflow-guiding structure thereof

Abstract

An electronic product (such as a switch) having an airflow-guiding structure and a method for fabricating the airflow-guiding structure thereof are disclosed, and are featured in using an industrial double-faced adhesive tape to mount a plastic airflow-guiding plate made of flame retardant grade of polypropylene in the housing, thereby forming an airflow path used for allowing air to flow from air inlets of a housing through an electronic element located in the housing, thus providing heat-dissipation function for the electronic element.

1 . An electronic product having an airflow-guiding structure, said electronic product comprising: 
 a housing, wherein at least one air inlet is disposed on one side of said housing for introducing airflow into said housing from the ambience;    at least one electrical circuit board disposed inside said housing;    at least one plastic airflow-guiding plate; and    at least one adhesive element used for mounting said plastic airflow-guiding plate inside said housing so as to form a flow path, wherein said airflow passes through said electrical circuit board from said air inlet for heat dissipation.    
   
   
       2 . The electronic product as claimed in  claim 1 , wherein said plastic airflow-guiding plate is made of flame retardant grade of polypropylene.  
   
   
       3 . The electronic product as claimed in  claim 1 , wherein said plastic airflow-guiding plate is made of electrically insulating material.  
   
   
       4 . The electronic product as claimed in  claim 1 , wherein a tensile yield stress of said plastic airflow-guiding plate is substantially greater than or equal to 3200 psi as measured according to ASTM D-882.  
   
   
       5 . The electronic product as claimed in  claim 1 , wherein said adhesive element is an industrial double-faced adhesive tape.  
   
   
       6 . The electronic product as claimed in  claim 1 , comprising: 
 at least one fan module mounted on said air inlet for sucking in said airflow.    
   
   
       7 . The electronic product as claimed in  claim 1 , wherein said plastic airflow-guiding plate contacts or is tightly adjacent to said electrical circuit board.  
   
   
       8 . The electronic product as claimed in  claim 1 , wherein said electrical circuit board comprises a chip.  
   
   
       9 . A method for fabricating an airflow-guiding structure, comprising: 
 providing a housing of an electronic product, wherein at least one air inlet is disposed on one side of said housing for introducing airflow into said housing from the ambience, and at least one electrical circuit board is disposed inside said housing;    forming at least one plastic airflow-guiding plate, wherein said plastic airflow-guiding plate is made of flame retardant grade of polypropylene; and    mounting said plastic airflow-guiding plate inside said housing for forming a flow path allowing said airflow to pass through said electrical circuit board from said air inlet for heat dissipation.    
   
   
       10 . The method as claimed in  claim 9 , wherein said step of mounting said plastic airflow-guiding plate inside said housing is performed by using at least one industrial double-faced adhesive tape, wherein one adhesive surface of said industrial double-faced adhesive tape is adhered to said housing, and the other adhesive surface of said industrial double-faced adhesive tape is adhered to said plastic airflow-guiding plate.  
   
   
       11 . The method as claimed in  claim 9 , wherein said plastic airflow-guiding plate is made of electrically insulating material.  
   
   
       12 . The method as claimed in  claim 9 , wherein a tensile yield stress of said plastic airflow-guiding plate is substantially greater than or equal to 3200 psi as measured according to ASTM D-882.  
   
   
       13 . The method as claimed in  claim 9 , wherein said plastic airflow-guiding plate contacts or is tightly adjacent to said electrical circuit board.  
   
   
       14 . The method as claimed in  claim 9 , wherein said electrical circuit board comprises a chip.