Method for producing molded parts for low-voltage, medium-voltage and high-voltage switchgear

Abstract

The invention relates to a method for producing molded parts for low-voltage, medium-voltage and high-voltage switchgear and to the corresponding switchgear according to the preamble of patent claims 1, 2, 3 and 17 . The aim of the invention is to remove the disadvantages mentioned in the description while providing an advantageous method. According to the invention, a mixture of spheres having a defined distribution of diameters of a size Dx are introduced into the casting compound and the components are cast directly.

1 . A method for production of moldings for switching devices for low-voltage, medium-voltage and high-voltage, characterized 
 in that a mixture of balls with a predetermined distribution of diameters of size Dx is introduced into the encapsulation compound thus creating direct encapsulation of components.    
   
   
       2 . A method for production of moldings for switching devices for low-voltage, medium-voltage and high-voltage, in particular as claimed in  claim 1 , characterized 
 in that a mixture of hollow balls with a predetermined distribution of external diameters of size Dx is introduced into the encapsulation compound.    
   
   
       3 . A method for production of switching devices for low-voltage, medium-voltage and high-voltage, in particular as claimed in  claim 1  and/or  2 , characterized 
 in that at least one switching chamber is provided with a cast surround composed of a first encapsulation compound, and is then encapsulated together with connections into a block composed of at least one second encapsulation compound such as silicone, soft epoxy or plastics.    
   
   
       4 . The method as claimed in  claim 1 ,  2  or  3 , characterized 
 in that epoxy resin is used as the first encapsulation compound, and silicone, polyurethane or a polyurethane derivative is used as the second encapsulation compound.    
   
   
       5 . The method as claimed in  claim 4 , characterized 
 in that the particles are introduced into the first and/or into the second encapsulation compound.    
   
   
       6 . The method as claimed in one of the preceding claims, characterized 
 in that the balls or the hollow balls are composed of glass.    
   
   
       7 . The method as claimed in  claim 1 ,  2  or  3 , characterized 
 in that the balls or the hollow balls are composed of ceramic, preferably of aluminum nitride.    
   
   
       8 . The method as claimed in one of the preceding claims, characterized 
 in that the filling level is set to be between 50 and 90%.    
   
   
       9 . The method as claimed in one of the preceding claims, characterized 
 in that other fillers in the form of small particles are mixed with the ball and/or hollow ball mixture.    
   
   
       10 . The method as claimed in one of the preceding claims, characterized 
 in that the other fillers are quartz powder or synthetic silica flour.    
   
   
       11 . The method as claimed in one of the preceding claims, characterized 
 in that the external diameters of the balls or hollow balls or particles have a bandwidth of 0.01 mm to 10 mm.    
   
   
       12 . The method as claimed in one of the preceding claims, characterized 
 in that the balls, hollow balls or particles have a mean density of 0.2 g/cm 3 .    
   
   
       13 . The method as claimed in one of the preceding claims, characterized 
 in that the balls, hollow balls or particles have a mean density of  0 . 37  g/cm 3 .    
   
   
       14 . The method as claimed in one of the preceding claims, characterized 
 in that the hollow balls have a diameter of up to 200 micrometers.    
   
   
       15 . The method as claimed in one of the preceding claims, characterized 
 in that the hollow balls have an effective density between 0.1 and 0.6 g/cm 3 .    
   
   
       16 . The method as claimed in one of the preceding claims, characterized 
 in that the solid balls have a density between 2.0 and 7.0 g/cm 3 .    
   
   
       17 . A switching device for low-voltage, medium-voltage and high-voltage, having encapsulated moldings, characterized 
 in that a mixture of balls and/or hollow balls and/or particles with a predetermined distribution of diameters of size Dx is introduced into the first encapsulation compound thus creating direct encapsulation of moldings, and the moldings of a switching device are composed of electrically insulating materials.    
   
   
       18 . A switching device for low-voltage, medium-voltage and high-voltage, having encapsulated moldings, characterized 
 in that the second encapsulation compound in which the moldings with cast surrounds are inserted and/or are once again encapsulated in this way is composed of electrically insulating materials, such as silicone, epoxy resin or polyurethane.    
   
   
       19 . The switching device as claimed in  claim 17  or  18 , characterized 
 in that at least one switching chamber is provided with a cast surround composed of a first encapsulation compound, and is then encapsulated together with connections into a block composed of at least one second encapsulation compound such as silicone, soft epoxy or plastics.    
   
   
       20 . The switching device as claimed in one of  claims 17  to  19 , characterized 
 in that epoxy resin is used as the first encapsulation compound, and silicone, polyurethane or a polyurethane derivative is used as the second encapsulation compound.    
   
   
       21 . The switching device as claimed in  claim 20 , characterized 
 in that said particles or balls are introduced into the first and/or into the second encapsulation compound.    
   
   
       22 . The switching device as claimed in  claim 21 , characterized 
 in that the balls or hollow balls are composed of glass or ceramic.    
   
   
       23 . The switching device as claimed in one of  claims 17  to  22 , characterized 
 in that the balls or hollow balls are composed of aluminum-nitride ceramic.    
   
   
       24 . The switching device as claimed in one of the preceding  claims 17  to  22 , characterized 
 in that the moldings or components of a switching device for each phase of a three-phase supply are each encapsulated to form a sealed block.    
   
   
       25 . The switching device as claimed in  claim 24 , characterized 
 in that the respective block is provided with heat-dissipating connection elements ( 2 ).