Method for producing and inspecting tape head air-skiving edges

Abstract

A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

1 . A method for manufacturing a tape head, comprising: 
 creating a slot in an upper face of a substrate of a tape head, the slot including at least one edge defining an edge of a tape bearing surface of the tape head;    forming and finishing the air bearing surface of the tape head; and    performing a grind operation to form a notch in the upper face of the substrate of the tape head, the notch extending from the slot to an outside end of the substrate of the tape head.    
   
   
       2 . The method as recited in  claim 1 , wherein the tape bearing surface of the tape head is formed and finished after creating the slot.  
   
   
       3 . The method as recited in  claim 1 , wherein the grind operation is performed after forming and finishing the tape bearing surface of the tape head.  
   
   
       4 . The method as recited in  claim 1 , wherein the slot includes a depth substantially equal to a depth of the notch.  
   
   
       5 . The method as recited in  claim 1 , wherein the slot includes a length substantially equal to a length of the notch.  
   
   
       6 . The method as recited in  claim 1 , wherein the edge of the tape bearing surface of the tape head includes a defect after the slot is created.  
   
   
       7 . The method as recited in  claim 6 , wherein the finishing removes the defect.  
   
   
       8 . The method as recited in  claim 1 , wherein the edge is inspected utilizing an interferometer.  
   
   
       9 . A method, comprising: 
 cutting a plurality of tape heads from a wafer;    attaching a closure to each of the tape heads;    creating a slot in an upper face of a substrate of each of the tape heads, each slot including at least one edge defining an edge of a tape bearing surface of the corresponding tape head;    forming and finishing the tape bearing surface of each of the tape heads;    separating the tape heads;    attaching a beam to each of the tape heads; and    performing a grind operation to form a notch in the upper face of the substrate of each of the tape heads, each notch extending from the slot to an outside end of the substrate of the corresponding tape head.