Heat dissipating system

Abstract

A heat dissipating system includes: a heat sink adapted to be connected to an electronic device; a coolant reservoir adapted for storing a coolant therein; a driving mechanism; a cooling mechanism; a coolant circulating conduit connected to the coolant reservoir, the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit; and a pressure stabilizing mechanism including a bypass connected to the coolant reservoir and the coolant circulating conduit at a position downstream of the driving mechanism, and a valve. The valve is opened when the pressure inside the coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass.

1 . A heat dissipating system for cooling an electronic device, said heat dissipating system comprising: 
 a heat sink adapted to be connected to the electronic device for absorbing heat from the electronic device;    a coolant reservoir adapted for storing a coolant therein;    a driving mechanism for drawing the coolant from said coolant reservoir;    a cooling mechanism;    a coolant circulating conduit connected to said coolant reservoir, said cooling mechanism, said heat sink, and said driving mechanism such that said driving mechanism draws the coolant from said coolant reservoir and drives circulation of the coolant in said coolant circulating conduit through said heat sink and said cooling mechanism so as to transfer heat from said heat sink to said cooling mechanism through the coolant; and    a pressure stabilizing mechanism including a bypass connected to said coolant reservoir and said coolant circulating conduit at a position downstream of said driving mechanism, and a valve that is normally closed, thereby forbidding fluid communication between said coolant reservoir and said coolant circulating conduit through said bypass, and that is opened when the pressure inside said coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between said coolant reservoir and said coolant circulating conduit through said bypass.    
   
   
       2 . The heat dissipating system of  claim 1 , wherein said valve is installed movably in said bypass, and is movable from a closed position to an open position when the pressure in said coolant circulating conduit exceeds the predetermined value.  
   
   
       3 . The heat dissipating system of  claim 1 , wherein said heat sink includes a container and a plurality of fins disposed in said container.  
   
   
       4 . The heat dissipating system of  claim 1 , wherein said cooling mechanism includes a fan and a plurality of fins connected to said coolant circulating conduit.  
   
   
       5 . The heat dissipating system of  claim 1 , wherein said driving mechanism includes a pump.