Liquid-ejecting head, liquid-ejecting apparatus, and method for manufacturing liquid-ejecting head

Abstract

The present invention is applicable to, for example, a thermal printing head to form shallow grooves M by removing the insulating films 21, 24, 30 , and 33 along at least the rows of the energy transducers.

1 . A liquid-ejecting head for ejecting droplets by driving energy transducers, comprising a head chip prepared by cutting a semiconductor substrate, wherein the energy transducers are provided along a side face, and at least one groove is formed, parallel to at least the side face along which the energy transducers are provided, by removing an insulating film.  
   
   
       2 . A liquid-ejecting apparatus for ejecting droplets by driving energy transducers on a liquid-ejecting head, wherein the liquid-ejecting head is formed with a head chip prepared by cutting a semiconductor substrate, the energy transducers are provided on the head chip along a side face, and at least one groove is formed, parallel to at least the side face along which the energy transducers are provided, by removing an insulating film.