Manufacturing of optoelectronic devices

Abstract

A method for manufacturing optoelectronic devices is disclosed. A layered structure may be formed with a plurality of layers including a bottom electrode layer, a top electrode layer, and one or more active layers between the top and bottom electrode layers. The layered structure is divided into one or more separate device module sections by cutting through one or more of the layers of the layered structure. At least one of the layers is an unpatterned layer at the time of cutting. Each of the resulting device module sections generally includes a portion of the active layer disposed between portions of the top and bottom electrode layers. An edge of a device section may optionally be protected against undesired electrical contact between two or more of the bottom electrode, top electrode and active layer portions. Two or more device module sections may be assembled into a device and connected in series by electrically connecting the bottom electrode layer portion of one device section to the top electrode layer portion of another device module section.

1 - 22 . (canceled)  
     
     
         23 . A photovoltaic device comprising: 
 a plurality of photovoltaic cells wherein each of the cells includes an active layer;    a plurality of connectors for electrically coupling one of the cells to an adjacent one of the cells; and    a plurality of strips of insulation, wherein each strip is in contact with an exposed edge of one of the photovoltaic cells to prevent electrical contact between adjacent photovoltaic cells except by way of the electrical connectors.    
     
     
         24 . The device of  claim 23 , wherein the photovoltaic cells are thin-film photovoltaic cells.  
     
     
         25 . The device of  claim 23 , wherein the connectors serially interconnect adjacent photovoltaic cells.  
     
     
         26 . The device of  claim 23 , wherein the strips of insulation are formed by a printing process.  
     
     
         27 . The device of  claim 23 , wherein the strips of insulation are formed by a lamination process.  
     
     
         28 . The device of  claim 23 , wherein cells each includes a substrate layer comprised of one of the following: molybdenum, aluminum, stainless steel, or combinations thereof.  
     
     
         29 . The device of  claim 23 , wherein each of the cells comprises a stack of a plurality of layers, wherein a lower electrode layer in one cell is connected by one of the connectors to a higher electrode layer in one of the adjacent cells.  
     
     
         30 . The device of  claim 23 , wherein each of the strips covers an exposed edge of an absorber layer in the cells.  
     
     
         31 . The device of  claim 23 , wherein each of the cells includes a CIGS-based absorber layer.  
     
     
         32 . The device of  claim 23 , wherein each of the cells includes a CdTe-based absorber layer.  
     
     
         33 . The device of  claim 23 , wherein each of the cells includes a CuIn 1-x Ga x (S or Se) 2 -based absorber layer.