Water-based polishing pads having improved adhesion properties and methods of manufacture

Abstract

The present invention provides a chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, and wherein the polymeric matrix is applied on a permeable substrate. The present invention provides a water-based polishing pad with reduced defectivity and improved polishing performance.

1 . A chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, and wherein the polymeric matrix is applied on a permeable substrate.  
     
     
         2 . The polishing pad of  claim 1  wherein the polymeric matrix is a urethane dispersion, acrylic dispersion, styrene dispersion or blends thereof.  
     
     
         2 . The polishing pad of  claim 1  wherein the polymeric matrix is a urethane dispersion, acrylic dispersion, styrene dispersion or blends thereof.  
     
     
         3 . The polishing pad of  claim 1  wherein the polymeric matrix comprises a blend of by weight percent 100:1 to 1:100 urethane to acrylic dispersion.  
     
     
         4 . The polishing pad of  claim 1  wherein the microspheres are selected from the group comprising polyvinyl alcohols, pectin, polyvinyl pyrrolidone, hydroxyethylcellulose, methylcellulose, hydropropylmethylcellulose, carboxymethylcellulose, hydroxypropylcellulose, polyacrylic acids, polyacrylamides, polyethylene glycols, polyhydroxyetheracrylites, starches, maleic acid copolymers, polyethylene oxide, polyurethanes, cyclodextrin, polyvinylidene dichloride, polyacrylonitrile and combinations thereof.  
     
     
         5 . The polishing pad of  claim 1  wherein the microspheres comprises at least 0.3 volume percent of the polishing pad.  
     
     
         6 . The polishing pad of  claim 1  wherein the polymeric matrix further comprises a defoamer, rheology modifier, anti-skinning agent or coalescent agent.  
     
     
         7 . A chemical mechanical polishing pad comprising, a polymeric matrix having porosity or filler dispersed therein, the polymeric matrix being formed of a blend of a urethane and acrylic dispersion at a ratio by weight percent of 100:1 to 1:100, and wherein the polymeric matrix is applied on a permeable substrate.  
     
     
         8 . A method of manufacturing a chemical mechanical polishing pad, comprising: 
 supplying a water-based fluid phase polymer composition containing microspheres onto a continuous transported permeable substrate;    shaping the polymer composition on the transported permeable substrate into a fluid phase polishing layer having a predetermined thickness;    curing the polymer composition on the transported permeable substrate in a curing oven to convert the polymer composition to a solid phase polishing layer of the polishing pad.    
     
     
         9 . The method of  claim 8  wherein the polymer composition comprises a urethane dispersion, acrylic dispersion, styrene dispersion or blends thereof.  
     
     
         10 . The method of  claim 8  wherein the microspheres are selected from the group comprising polyvinyl alcohols, pectin, polyvinyl pyrrolidone, hydroxyethylcellulose, methylcellulose, hydropropylmethylcellulose, carboxymethylcellulose, hydroxypropylcellulose, polyacrylic acids, polyacrylamides, polyethylene glycols, polyhydroxyetheracrylites, starches, maleic acid copolymers, polyethylene oxide, polyurethanes, cyclodextrin, polyvinylidene dichloride, polyacrylonitrile and combinations thereof.