Method of forming a stacked polishing pad using laser ablation

Abstract

The present invention provides a method of manufacturing a polishing pad for chemical mechanical polishing, comprising laminating a top polishing pad to a sub-polishing pad to form a stacked pad and transferring the stacked pad to a laser-ablation station containing a laser. Further the invention provides modulating a laser beam from the laser to modify both the top polishing pad and the sub-polishing pad and inspecting the laser-ablated stacked pad.

1 . A method of manufacturing a polishing pad for chemical mechanical polishing, comprising: 
 laminating a top polishing pad to a sub-polishing pad to form a stacked pad;    transferring the stacked pad to a laser-ablation station containing a laser;    modulating a laser beam from the laser to modify both the top polishing pad and the sub-polishing pad; and    inspecting the laser-ablated stacked pad.    
     
     
         2 . The method of  claim 1  further comprising laser ablating CNC holes into the polishing pads.  
     
     
         3 . The method of  claim 1  further comprising grooving the top polishing pad, the pad containing a window therein.  
     
     
         4 . The method of  claim 1  further comprising laser ablating different top polishing and sub-polishing pads to form a composite polishing pad.  
     
     
         5 . The method of  claim 1  further comprising laser ablating an edge of the sub-polishing pad to seal the sub-polishing pad.  
     
     
         6 . The method of  claim 1  further comprising leveling the polishing pad.  
     
     
         7 . A method of manufacturing a composite polishing pad for chemical mechanical polishing, comprising: 
 laminating a top polishing pad to a sub-polishing pad with an adhesive layer to form a stacked pad;    transferring the stacked pad to a laser-ablation station containing a laser;    modulating a laser beam from the laser to modify the top polishing pad, adhesive layer and the sub-polishing pad from a specific reference point; and    inspecting the laser-ablated stacked pad from the specific reference point without transferring the stacked pad.    
     
     
         8 . The method of  claim 7  further comprising laser ablating CNC holes into the polishing pads.  
     
     
         9 . The method of  claim 7  further comprising laser ablating an edge of the sub-polishing pad to seal the sub-polishing pad.  
     
     
         10 . The method of  claim 7  further comprising laser ablating at least another adhesive layer in the polishing pad.