Light emitting device

Abstract

A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.

1 . A light emitting device, at least comprising: 
 a light emitting element having at least two electrodes disposed at a side of a light output surface thereof;    a base member comprising a recess and a plurality of lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward an opening of the recess that converges while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection.    
   
   
       2 . The light emitting device of  claim 1 , wherein the light emitting element comprises at least one substrate provided with electrodes for power connection and at least one light emitting chip mounted on the substrate and electrically connected with the substrate.  
   
   
       3 . The light emitting device of  claim 1  or  2 , wherein the light emitting element is selected from the group consisting of single color single chip, single color multi-chip, multi-color multi-chip and chip(s) emitting ultraviolet light.  
   
   
       4 . The light emitting device of  claim 2 , wherein the light emitting chip in a flip-chip configuration is electrically connected with the substrate via one of the group consisting of gold balls, tin balls and electrically and thermally conductive material.  
   
   
       5 . The light emitting device of  claim 2 , wherein the light emitting chip is an LED chip.  
   
   
       6 . The light emitting device of  claim 2 , wherein the substrate is selected from the group consisting of Si, Al and C.  
   
   
       7 . The light emitting device of  claim 1 , wherein the base member is a lead frame.  
   
   
       8 . The light emitting device of  claim 7 , wherein the lead frame is formed by one of the methods consisting of injection molding and assembly.  
   
   
       9 . The light emitting device of  claim 7 , wherein the lead frame is mainly formed of one of the group consisting of PPA resin, PC thermoplastic material and insulating material.  
   
   
       10 . The light emitting device of  claim 1 , wherein a light reflecting portion is further disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.  
   
   
       11 . The light emitting device of  claim 10 , wherein the light reflecting portion is formed of reflective material by one of the methods consisting of electroplating and assembling.  
   
   
       12 . The light emitting device of  claim 1 , wherein a light converting portion is further disposed in the recess adjacent to the light output surface to change the wavelength of the light emitted from the light emitting element so as to improve light efficiency.  
   
   
       13 . The light emitting device of  claim 12 , wherein the light converting portion is formed of fluorescent converting material by coating.  
   
   
       14 . The light emitting device of  claim 10 , wherein the recess is filled with sealing member to fix the light reflecting portion and the light emitting element to the base member.  
   
   
       15 . The light emitting device of  claim 12 , wherein the recess is filled with sealing member to fix the light converting portion and the light emitting element to the base member.  
   
   
       16 . The light emitting device of  claim 15 , wherein the sealing member further forms a lens shape at the light output surface of the light emitting element to improve light collecting efficiency.  
   
   
       17 . The light emitting device of  claim 1 , wherein the lead portions are formed of electrically conductive conductor.  
   
   
       18 . The light emitting device of  claim 17 , wherein the conductor is one of the group consisting of Au, Ag, Cu, Sn, Al and conductive material.  
   
   
       19 . The light emitting device of  claim 1  or  17 , wherein the lead portions are electrically connected with the electrodes of the light emitting element through one of the group consisting of conductive adhesive, gold balls, tin balls and conductive bonding material.  
   
   
       20 . The light emitting device of  claim 19 , wherein the conductive adhesive is one of the group consisting of silver paste, solder paste and solder paste containing lead.  
   
   
       21 . The light emitting device of  claim 1  further includes a thermal conductor attached to a surface of the light emitting element opposite to the light output surface for heat dissipation.  
   
   
       22 . The light emitting device of  claim 21 , wherein the thermal conductor is formed of one of the group consisting of Al, Cu, Fe and material having a thermal conductivity of at least 50 W/mK.  
   
   
       23 . The light emitting device of  claim 21 , wherein an adhesive layer is further disposed between the thermal conductor and the light emitting element.  
   
   
       24 . The light emitting device of  claim 23 , wherein the adhesive layer is formed of heat sink paste.  
   
   
       25 . A light emitting device, comprising: 
 a light emitting element having at least two electrodes disposed at the side of the light output surface thereof;    a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency, the recess being filled with sealing member to fix the light reflecting portion and the light emitting element to the base member; and    a thermal conductor attached to a surface of the light emitting element opposite to the light output surface for heat dissipation.    
   
   
       26 . The light emitting device of  claim 25 , wherein the light emitting element comprises at least one substrate provided with electrodes for power connection and at least one light emitting chip mounted on the substrate and electrically connected with the substrate.  
   
   
       27 . The light emitting device of  claim 25  or  26 , wherein the light emitting element comprises one of the group consisting of single color single chip, single color multi-chip, multi-color multi-chip and chip(s) emitting ultraviolet light.  
   
   
       28 . The light emitting device of  claim 26 , wherein the light emitting chip in a flip-chip configuration is electrically connected with the substrate via one of the group consisting of gold balls, tin balls and electrically and thermally conductive material.  
   
   
       29 . The light emitting device of  claim 26  or  8 , wherein the light emitting chip is an LED chip.  
   
   
       30 . The light emitting device of  claim 26 , wherein the substrate is made of one of the group consisting of Si, Al and C.  
   
   
       31 . The light emitting device of  claim 25 , wherein the base member is a lead frame.  
   
   
       32 . The light emitting device of  claim 31 , wherein the lead frame is formed by one of the methods consisting of injection molding and assembly.  
   
   
       33 . The light emitting device of  claim 31  or  32 , wherein the lead frame is mainly formed of one of the group consisting of PPA resin, PC thermoplastic material and insulating material.  
   
   
       34 . The light emitting device of  claim 25 , wherein the lead portions are formed of electrically conductive conductor.  
   
   
       35 . The light emitting device of  claim 34 , wherein the conductor is one of the group consisting of Au, Ag, Cu, Sn, Al and conductive material.  
   
   
       36 . The light emitting device of  claim 25  or  34 , wherein the lead portions are further electrically connected with the electrodes of the light emitting element through one of the group consisting of conductive adhesive, gold balls, tin balls and conductive bonding material.  
   
   
       37 . The light emitting device of  claim 36 , wherein the conductive adhesive is one of the group consisting of silver paste, solder paste and solder paste containing lead.  
   
   
       38 . The light emitting device of  claim 25 , wherein the sealing member forms a lens shape at the light output surface of the light emitting element to improve light collecting efficiency.  
   
   
       39 . The light emitting device of  claim 25 , wherein light reflecting portion is formed of reflective material by one of the methods consisting of electroplating and assembling.  
   
   
       40 . The light emitting device of  claim 25 , wherein the thermal conductor is formed of one of the group consisting of Al, Cu, Fe and material having a thermal conductivity of at least 50 W/mK.  
   
   
       41 . The light emitting device of  claim 25 , wherein an adhesive layer is further disposed between the thermal conductor and the light emitting element.  
   
   
       42 . The light emitting device of  claim 41 , wherein the adhesive layer is formed of heat sink paste.  
   
   
       43 . A light emitting device, comprising: 
 a light emitting element with at least two electrodes disposed at the side of the light output surface thereof;    a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light converting portion is disposed in the recess adjacent to the light output surface to change the wavelength of the light emitted from the light emitting element so as to improve light efficiency, the recess being filled with sealing member to fix the light converting portion and the light emitting element to the base member; and    a thermal conductor attached to a surface of the light emitting element opposite to the light output surface for heat dissipation.    
   
   
       44 . The light emitting device of  claim 43 , wherein the light emitting element comprises at least one substrate provided with electrodes for power connection and at least one light emitting chip mounted on the substrate and electrically connected with the substrate.  
   
   
       45 . The light emitting device of  claim 43 , wherein the light emitting element comprises one of the group consisting of single color single chip, single color multi-chip, multi-color multi-chip and chip(s) emitting ultraviolet light.  
   
   
       46 . The light emitting device of  claim 44 , wherein the light emitting chip in a flip-chip configuration is electrically connected with the substrate via one of the group consisting of gold balls, tin balls and electrically and thermally conductive material.  
   
   
       47 . The light emitting device of  claim 44 , wherein the light emitting chip is an LED chip.  
   
   
       48 . The light emitting device of  claim 44 , wherein the substrate is made of one of the group consisting of Si, Al and C.  
   
   
       49 . The light emitting device of  claim 43 , wherein the substrate is a lead frame.  
   
   
       50 . The light emitting device of  claim 49 , wherein the lead frame is formed by one of the methods consisting of injection molding and assembly.  
   
   
       51 . The light emitting device of  claim 49 , wherein the lead frame is mainly formed of one of the group consisting of PPA resin, PC thermoplastic material and insulating material.  
   
   
       52 . The light emitting device of  claim 43 , wherein the lead portions are formed of electrically conductive conductor.  
   
   
       53 . The light emitting device of  claim 52 , wherein the conductor is one of the group consisting of Au, Ag, Cu, Sn, Al and conductive material.  
   
   
       54 . The light emitting device of  claim 43  or  52 , wherein the lead portions are electrically connected with the electrodes of the light emitting element through one of the group consisting of conductive adhesive, gold balls, tin balls and conductive bonding material.  
   
   
       55 . The light emitting device of  claim 54 , wherein the conductive adhesive is one of the group consisting of silver paste, solder paste and solder paste containing lead.  
   
   
       56 . The light emitting device of  claim 43 , wherein the sealing member further forms a lens shape at the light output surface of the light emitting element to improve light collecting efficiency.  
   
   
       57 . The light emitting device of  claim 43 , wherein the light converting portion is formed of fluorescent converting material by coating.  
   
   
       58 . The light emitting device of  claim 43 , wherein the thermal conductor is formed of one of the group consisting of Al, Cu, Fe and material having a thermal conductivity of at least 50 W/mK.  
   
   
       59 . The light emitting device of  claim 43 , wherein an adhesive layer is further disposed between the thermal conductor and the light emitting element.  
   
   
       60 . The light emitting device of  claim 59 , wherein the adhesive layer is formed of heat sink paste.