Low melting temperature compliant solders

Abstract

Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.

1 . A low melting temperature compliant solder alloy consisting essentially of from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.  
   
   
       2 . The low melting temperature compliant solder alloy of  claim 1 , wherein the alloy comprises at most about 3.0% by weight indium.  
   
   
       3 . The low melting temperature compliant solder alloy of  claim 1 , wherein the alloy comprises at most about 2.5% by weight indium.  
   
   
       4 . The low melting temperature compliant solder alloy of  claim 1 , wherein the alloy includes traces of impurities.  
   
   
       5 . The low melting temperature compliant solder alloy of  claim 1 , wherein the alloy does not include traces of impurities.  
   
   
       6 . The low melting temperature compliant solder alloy of  claim 1 , further consisting of from about 0.01% to about 3.0% by weight at least one dopant selected from the group consisting of zinc (Zn), nickel (Ni), iron (Fe), cobalt (Co), germanium (Ge), phosphorus (P), aluminum (Al), antimony (Sb), cadmium (Cd), tellurium (Te), bismuth (Bi), platinum (Pt), rare earth elements, and combinations thereof to improve oxidation resistance and increase physical properties and thermal fatigue resistance.  
   
   
       7 . The low melting temperature compliant solder alloy of  claim 6 , wherein the rare earth elements are selected from the group consisting of cerium (Ce), lanthanum (La), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), actinium (Ac), thorium (Th), protactinium (Pa), and combinations thereof.  
   
   
       8 . A low melting temperature compliant solder alloy consisting essentially of from about 89.7% to about 94.499% by weight tin, from about 3.5% to about 6.0% by weight silver, from about 0.0% to about 0.3% by weight copper, and from about 2.001% to about 4.0% by weight indium.  
   
   
       9 . The low melting temperature compliant solder alloy of  claim 8 , wherein the alloy comprises at most about 3.0% by weight indium.  
   
   
       10 . The low melting temperature compliant solder alloy of  claim 8 , wherein the alloy comprises at most about 2.5% by weight indium.  
   
   
       11 . The low melting temperature compliant solder alloy of  claim 8 , wherein the alloy includes traces of impurities.  
   
   
       12 . The low melting temperature compliant solder alloy of  claim 8 , wherein the alloy does not include traces of impurities.  
   
   
       13 . The low melting temperature compliant solder alloy of  claim 8 , further consisting of from about 0.01% to about 3.0% by weight at least one dopant selected from the group consisting of zinc (Zn), nickel (Ni), iron (Fe), cobalt (Co), germanium (Ge), phosphorus (P), aluminum (Al), antimony (Sb), cadmium (Cd), tellurium (Te), bismuth (Bi), platinum (Pt), rare earth elements, and combinations thereof to improve oxidation resistance and increase physical properties and thermal fatigue resistance.  
   
   
       14 . The low melting temperature compliant solder alloy of  claim 13 , wherein the rare earth elements are selected from the group consisting of cerium (Ce), lanthanum (La), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), actinium (Ac), thorium (Th), protactinium (Pa), and combinations thereof.