Packaging method of a light-sensing semiconductor device and packaging structure thereof

Abstract

The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

1 . A packaging method of a light-sensing semiconductor device, comprising the following steps: 
 providing a light-sensing wafer, wherein said wafer has multiple light-sensing chips, and each said light-sensing chip has a light-sensing region;    forming a buffer layer on said light-sensing wafer;    removing a portion of said buffer layer, with the remaining said buffer layer respectively forming a spacer wall on a non-light-sensing region, which is disposed along the perimeter of each said light-sensing chip;    applying an adhesive to between neighboring said spacer walls on said non-light-sensing regions and; and    affixing a light transparent cover to said spacer walls via said adhesive, with said light-sensing regions, said spacer walls and said light transparent cover forming at least one airtight spaces.    
   
   
       2 . The packaging method of a light-sensing semiconductor device according to  claim 1 , wherein said step of “removing a portion of said buffer layer” is implemented with an etching method.  
   
   
       3 . The packaging method of a light-sensing semiconductor device according to  claim 1 , wherein before said step of forming said spacer walls, multiple trenches are formed on said buffer layer in order to respectively provide one common said trench for the tops of every two neighboring said spacer walls.  
   
   
       4 . The packaging method of a light-sensing semiconductor device according to  claim 1 , wherein forming said trenches is implemented with an etching method.  
   
   
       5 . The packaging method of a light-sensing semiconductor device according to  claim 1 , wherein said step of “affixing a light transparent cover to said spacer walls” is undertaken in a vacuum chamber, and said light-sensing regions, said spacer walls and said light transparent cover form at least one evacuated and airtight spaces.  
   
   
       6 . The packaging method of a light-sensing semiconductor device according to  claim 1 , further comprising a cutting step, wherein said light-sensing wafer is divided by said light-sensing chip in order to form multiple light-sensing semiconductor devices.  
   
   
       7 . A packaging structure of a light-sensing semiconductor device, comprising: 
 a light-sensing wafer, having multiple light-sensing chips, wherein each said light-sensing chip has a light-sensing region and a non-light-sensing region;    multiple spacer walls, separately encircling each said non-light-sensing region, which is around the perimeter of corresponding said light-sensing chip;    at least one adhesive, disposed between every two neighboring said spacer walls on said non-light-sensing regions; and    at least one light transparent cover, affixed to said spacer walls with said adhesive, and covering said light-sensing regions, with said light-sensing regions, said spacer walls and said light transparent cover forming at least one airtight spaces.    
   
   
       8 . The packaging structure of a light-sensing semiconductor device according to  claim 7 , wherein one identical said light transparent cover may cover either multiple said light-sensing chips or only one said light-sensing chip.  
   
   
       9 . The packaging structure of a light-sensing semiconductor device according to  claim 7 , wherein said adhesive is a thermosetting glue or a UV glue.  
   
   
       10 . The packaging structure of a light-sensing semiconductor device according to  claim 7 , wherein multiple trenches are separately formed on the tops of every two neighboring said spacer walls, and said adhesive is filled into said trenches.  
   
   
       11 . The packaging structure of a light-sensing semiconductor device according to  claim 7 , wherein said light transparent cover can filter out a light of a specific wavelength.  
   
   
       12 . The packaging structure of a light-sensing semiconductor device according to  claim 11 , wherein said light transparent cover can filter out a far-infrared ray.  
   
   
       13 . The packaging structure of a light-sensing semiconductor device according to  claim 7 , wherein said spacer wall is made of a photoresist material.  
   
   
       14 . The packaging structure of a light-sensing semiconductor device according to  claim 7 , wherein said light-sensing wafer is further cut by said light-sensing chip in order to form multiple light-sensing semiconductor devices, wherein each said light-sensing semiconductor device comprises: one said light-sensing chip, one said spacer wall, one said light transparent cover and one said adhesive for sealing those said parts.