Polishing pad and polishing apparatus

Abstract

A polishing pad according to the invention includes a plate-like pad body having one surface serving as a polishing surface and the other surface serving as a support surface, and a plurality of hole parts which extend from the polishing surface to the support surface, the each hole part containing a plurality of elongated holes that extend in different directions on a plane of the polishing surface.

1 . A polishing pad which polishes a to-be-polished object, comprising: 
 a plate-like pad body having one surface serving as a polishing surface and the other surface serving as a support surface; and    a plurality of hole parts configure to extend from the polishing surface to the support surface, said each hole part containing a plurality of elongated holes that extend in different directions on a plane of the polishing surface.    
     
     
         2 . The polishing pad according to  claim 1 , wherein the elongated holes of said each hole part radially extend from a predetermined position.  
     
     
         3 . The polishing pad according to  claim 2 , wherein the elongated hole is plural in number.  
     
     
         4 . The polishing pad according to  claim 2 , wherein the elongated hole takes a cross-shape.  
     
     
         5 . The polishing pad according to  claim 2 , wherein a shape of the elongated hole includes a linear shape.  
     
     
         6 . The polishing pad according to  claim 2 , wherein a shape of the elongated hole includes a curve shape.  
     
     
         7 . The polishing pad according to  claim 1 , wherein the hole parts are arrayed at equal intervals.  
     
     
         8 . The polishing pad according to  claim 1 , wherein the support surface of the pad body is provided with a communicating hole which communicates the adjacent hole parts with each other.  
     
     
         9 . A polishing apparatus comprising: 
 a plate-like polishing pad provided on a surface plate, the polishing pad having one surface serving as a polishing surface and the other surface serving as a support surface attached to the surface plate, and the pad body including a plurality of hole parts configure to extend from the polishing surface to the support surface, said each hole part containing a plurality of elongated holes that extend in different directions on a plane of the polishing surface;    a holder member arranged to face the polishing pad, the holder member holding a to-be-polished object; and    a drive mechanism configure to polish the to-be-polished object by relatively and frictionally moving the polishing pad and the to-be-polished object held by the holder member.    
     
     
         10 . The polishing apparatus according to  claim 9 , wherein the drive mechanism relatively moves the to-be-polished object and the holder member in a friction manner such that they are separated from a part on the peripheral part of the polishing surface where some of the hole parts are exposed.  
     
     
         11 . The polishing apparatus according to  claim 9 , wherein the elongated holes of said each hole part radially extend from a predetermined position.  
     
     
         12 . The polishing apparatus according to  claim 9 , wherein the support surface of the pad body is provided with a communicating means which communicates the adjacent hole parts with each other.  
     
     
         13 . A method of polishing a to-be-polishing surface of a to-be-polished object, comprising: 
 holding a plate-like polishing pad provided on a surface plate, the polishing pad having one surface serving as a polishing surface and the other surface serving as a support surface attached to the surface plate, and the pad body including a plurality of hole parts which extend from the polishing surface to the support surface, said each hole part containing a plurality of elongated holes that extend in different directions on a plane of the polishing surface;    holding a to-be-polished object by a holder member such that the to-be-polished object is arranged to face the polishing pad; and    moving the polishing pad relative to the to-be-polished object in a friction manner.    
     
     
         14 . The polishing method according to  claim 13 , wherein the to-be-polished object and the holder member are relatively moved in a friction manner such that, while being separated from a part on the peripheral part of the polishing surface where some of the hole parts are exposed.  
     
     
         15 . The polishing method according to  claim 13 , wherein the elongated holes of said each hole part radially extend from a predetermined position.  
     
     
         16 . The polishing method according to  claim 13 , wherein the support surface of the pad body is provided with a communicating hole which communicates the adjacent hole parts with each other.