White multi-wavelength LED & its manufacturing process

Abstract

A white multi-wavelength LED and its manufacturing process has bonded at the bottom of a light emitting chip in a given color a first non-conductive material containing phosphor in a corresponding color to that of the chip to become a die unit; the first non-conductive material functioning as the position where the die unit is bonded to a carrier; golden plated wire constituting the circuit connection of the chip; a second non-conductive material containing phosphor in a color corresponding to that of the chip being injected to cover up the top of the chip to emit the expected white light and effectively promote the luminance performance of the LED.

1 . A die unit has bonded at the bottom of a light emitting chip in a given color a first non-conductive material containing phosphor in the corresponding color to that of the chip; the light from the chip being allowed to smoothly pass the first non-conductive material and to be incorporated with the wavelength of the phosphor to produce the expected white light.  
   
   
       2 . A die unit has bonded at the bottom of a light emitting chip in a given color a first non-conductive material containing phosphor in a corresponding color to that of the chip; and on the top of the light emitting chip a second non-conductive material containing phosphor in a corresponding color to that of the chip; and the light the light from the chip being allowed to smoothly pass the first and the second non-conductive material and to be incorporated with the wavelength of the phosphor to produce the expected white light.  
   
   
       3 . The die unit of  claim 1 , wherein, a reflective material is disposed at the bottom of the first non-conductive material.  
   
   
       4 . The die unit of  claim 2 , wherein, a reflective material is disposed at the bottom of the first non-conductive material.  
   
   
       5 . A white multi-wavelength LED includes a die unit having bonded at the bottom of a light emitting chip in a given color a first non-conductive material containing phosphor in a corresponding color to that of the chip, and the first non-conductive material serving as the position for coating an encapsulating material to secure the die unit to a carrier; a second non-conductive material containing phosphor in a corresponding color to that of the chip to cover up the chip.  
   
   
       6 . The white multi-wavelength LED of  claim 5 , wherein the light emitting chip relates to a blue light emitting chip, red phosphor is mixed into the first non-conductive material, and green phosphor is mixed into the second non-conductive material.  
   
   
       7 . The white multi-wavelength LED of  claim 5 , wherein the light emitting chip relates to an approximate ultraviolet light emitting chip, red phosphor is mixed into the first non-conductive material, and green phosphor and blue phosphor are mixed into the second non-conductive material.  
   
   
       8 . A white multi-wavelength LED manufacturing process includes the following steps: 
 a. Prepare a light emitting chip in a given color;    b. A die unit is prepared by having a first non-conductive material containing phosphor in a color corresponding to that of the light emitting chip bonded to the bottom of the light emitting chip;    c. Bond the die unit to a carrier with an encapsulating material;    d. Inject a second non-conductive material containing phosphor in a color corresponding to that of the light emitting chip into the carrier to cover up the light emitting chip;    e. Finish with the baking process.    
   
   
       9 . A white multi-wavelength LED manufacturing process includes the following steps: 
 a. Prepare a light emitting chip in a given color;    b. A die unit is prepared by having a first non-conductive material containing phosphor in a color corresponding to that of the light emitting chip bonded to the bottom of the light emitting chip, a second non-conductive material containing phosphor in a color corresponding to that of the light emitting chip bonded to the top of the light emitting chip;    c. Bond the die unit to a carrier with an encapsulating material with an encapsulating material; and    d. Finish with the baking process.    
   
   
       10 . The white multi-wavelength LED manufacturing process of  claim 8 , wherein the light emitting chip relates to a blue light emitting chip, red phosphor is mixed into the first non-conductive material, and green phosphor is mixed into the second non-conductive material.  
   
   
       11 . The white multi-wavelength LED manufacturing process of  claim 9 , wherein the light emitting chip relates to a blue light emitting chip, red phosphor is mixed into the first non-conductive material, and green phosphor is mixed into the second non-conductive material.  
   
   
       12 . The white multi-wavelength LED manufacturing process of  claim 8 , wherein the light emitting chip relates to an approximate ultraviolet light emitting chip, red phosphor is mixed into the first non-conductive material, and green phosphor and blue phosphor are mixed into the second non-conductive material.  
   
   
       13 . The white multi-wavelength LED manufacturing process of  claim 9 , wherein the light emitting chip relates to an approximate ultraviolet light emitting chip, red phosphor is mixed into the first non-conductive material, and green phosphor and blue phosphor are mixed into the second non-conductive material.